5AGXFB5H4F35I5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 23625728 420000 1152-BBGA, FCBGA

Quantity 628 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158491Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23625728

Overview of 5AGXFB5H4F35I5G – Arria V GX FPGA, 1152‑BBGA (FCBGA)

The 5AGXFB5H4F35I5G is an Intel Arria V GX field-programmable gate array (FPGA) in a 1152‑BBGA FCBGA package designed for high-density programmable logic applications. The device provides approximately 420,000 logic elements, roughly 23.6 Mbits of embedded RAM, and 544 user I/O pins, offering a balance of logic, on-chip memory, and I/O capacity for complex embedded and industrial designs.

Rated for industrial operation with a supply voltage range of 1.07 V to 1.13 V and an operating temperature range of −40 °C to 100 °C, this surface-mount device is intended for systems that require significant programmable logic, substantial on-chip memory, and broad I/O connectivity.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements, providing a large fabric for complex logic implementation and system integration.
  • Logic Array Blocks (CLBs)  158,491 CLBs reported in device data for granular resource planning.
  • Embedded Memory  Approximately 23.6 Mbits of total on-chip RAM for buffering, packet processing, and local data storage.
  • I/O and Peripherals  544 device I/O pins to support wide external interfacing and parallel or serial subsystem connections.
  • Package and Mounting  1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, FC, 35×35) in a surface-mount form factor for PCB assembly.
  • Power  Core supply operating range of 1.07 V to 1.13 V to match system power delivery requirements.
  • Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for use in industrial environmental conditions.
  • Compliance  RoHS‑compliant for environmental and regulatory considerations.

Typical Applications

  • High‑density signal processing  Use the large logic fabric and substantial embedded RAM to implement DSP pipelines, multi-channel filtering, and custom accelerators.
  • Industrial control and automation  Industrial-grade temperature range and robust I/O count make the device suitable for factory automation controllers and process-control systems.
  • Protocol bridging and packet handling  Ample logic and RAM resources support protocol conversion, packet buffering, and custom networking logic.
  • Embedded system integration  Integrate multiple subsystems and custom peripherals on‑chip to reduce external components and simplify board-level design.

Unique Advantages

  • Substantial programmable logic: 420,000 logic elements support complex, multi-function designs without excessive external ASIC dependence.
  • Significant on‑chip memory: Approximately 23.6 Mbits of embedded RAM enables local storage for high-throughput algorithms and buffering.
  • Extensive I/O connectivity: 544 I/O pins facilitate dense external interfacing and large peripheral integration.
  • Industrial operating range: −40 °C to 100 °C qualification supports deployment in harsh or wide-temperature environments.
  • FCBGA surface-mount package: 1152‑BBGA/1152‑FBGA (35×35) package supports compact PCB layouts and standard assembly processes.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and product requirements.

Why Choose 5AGXFB5H4F35I5G?

The 5AGXFB5H4F35I5G Arria V GX FPGA delivers a combination of high logic density, substantial embedded RAM, and broad I/O capability in a robust industrial package. Those requirements—combined with its surface-mount 1152‑BBGA form factor and defined core voltage and temperature operating ranges—make it suitable for engineers designing advanced embedded systems, industrial controllers, and high‑throughput interfaces that need on‑device programmability and local memory.

This device is appropriate for designs that must scale logic, memory, and I/O without increasing board complexity, and where industrial temperature performance and RoHS compliance are required.

If you would like pricing, availability, or a formal quote for 5AGXFB5H4F35I5G, submit a request to sales or request a quote through your procurement channel.

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