5AGXMB7G4F35C4N

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA Exposed Pad

Quantity 565 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs23780Number of Logic Elements/Cells504000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits27695104

Overview of 5AGXMB7G4F35C4N – Arria V GX FPGA, 504,000 logic elements, 544 I/Os

The 5AGXMB7G4F35C4N is an Intel Arria V GX Field Programmable Gate Array (FPGA) delivered in a 1152-BBGA exposed-pad package. It provides a high-density programmable fabric with 504,000 logic elements and approximately 27.7 Mbits of on-chip RAM, combined with 544 user I/O pins for complex I/O and system integration.

Designed and specified for commercial-grade operation, this device's datasheet coverage includes electrical characteristics, switching performance, configuration timing, and I/O timing, making it suitable for designs requiring a documented, high-density FPGA building block.

Key Features

  • High logic density — 504,000 logic elements to implement large, complex digital designs and custom logic functions.
  • Embedded memory — Approximately 27.7 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic.
  • Extensive I/O — 544 available I/O pins to interface with wide buses, multiple peripherals, and dense board-level connectivity.
  • Power supply range — Core voltage specified from 1.07 V to 1.13 V for predictable power design and rail planning.
  • Commercial temperature grade — Rated for 0 °C to 85 °C operation to meet standard commercial-environment requirements.
  • Package and mounting — 1152-BBGA (1152-FBGA, 35×35) exposed-pad, surface-mount package for high-density PCB integration and thermal interface.
  • Standards and compliance — RoHS compliant for regulatory and manufacturing compatibility.
  • Documented device family — Arria V device datasheet provides electrical, switching, configuration, and I/O timing specifications for design verification and system integration.

Typical Applications

  • Programmable system logic — Large-scale programmable fabric for implementing complex control, data-path, or custom processing functions.
  • High-density I/O integration — Designs requiring many parallel or serial interfaces can leverage the 544 available I/Os for board-level connectivity.
  • On-chip memory intensive designs — Use cases that need embedded RAM for buffering, packet storage, or LUT-based functions benefit from approximately 27.7 Mbits of internal memory.

Unique Advantages

  • Large programmable fabric: 504,000 logic elements enable implementation of sizeable custom logic cores and complex state machines without external ASICs.
  • Integrated memory capacity: Approximately 27.7 Mbits of embedded RAM reduces reliance on external memory for many applications, simplifying BOM and board routing.
  • High I/O count: 544 I/Os support broad peripheral interfacing and multi-channel data handling directly from the FPGA package.
  • Commercial-grade reliability: Specified for 0 °C to 85 °C operation to match standard commercial deployment environments.
  • Compact BGA package: 1152-BBGA exposed-pad in a 35×35 supplier package allows high-density PCB layouts with an exposed pad for thermal management.
  • Documented electrical and configuration specs: The Arria V datasheet includes detailed electrical characteristics, switching and configuration timing useful for system validation and integration.

Why Choose 5AGXMB7G4F35C4N?

This Arria V GX FPGA part provides a combination of high logic capacity, substantial embedded memory, and a large I/O count in a compact surface-mount BGA package. It is positioned for commercial designs that require significant on-chip logic and memory resources while maintaining clear electrical and configuration documentation for engineering validation.

Engineers and procurement teams seeking a high-density, RoHS-compliant FPGA with defined core voltage and commercial temperature rating will find the 5AGXMB7G4F35C4N suitable for demanding programmable-logic implementations where integration density and documented device behavior matter.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5AGXMB7G4F35C4N Arria V GX FPGA.

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