5AGXMB7G4F35I5N

The Intel 5AGXMB7G4F35I5N is an Arria V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA exposed‑pad package. It delivers a high logic density fabric combined with substantial on‑chip memory and a large I/O complement for complex, customizable digital designs.

Targeted at industrial applications, this device provides a defined core voltage range (1.07 V to 1.13 V) and an extended operating temperature window (−40 °C to 100 °C), making it suitable for systems that require robust operation across wide environmental ranges.

Key Features

• Core Logic — 504,000 logic elements to implement large-scale, deeply pipelined, or highly parallel logic functions.
• Embedded Memory — Approximately 27.7 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count — 544 user I/O pins to support multi‑channel interfaces and high‑density board designs.
• Package & Mounting — 1152‑BBGA (1152‑FBGA, 35×35) exposed‑pad surface‑mount package for compact PCB integration and thermal conduction.
• Power — Defined core supply range of 1.07 V to 1.13 V to match system power‑rail planning and regulator selection.
• Temperature & Grade — Industrial grade device with an operating range of −40 °C to 100 °C for sustained performance in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial control and automation — Leverages industrial temperature range and large I/O count for sensor, actuator, and real‑time control logic integration.
• High‑density I/O systems — 544 I/O pins enable aggregation and routing of many parallel signals for data acquisition, switching, or board‑level glue logic.
• Signal processing and custom compute — High logic element count and substantial embedded memory support complex DSP algorithms and on‑chip data buffering.
• Prototyping and system integration — Use as a platform for validating hardware architectures that require significant programmable logic and memory resources.

Unique Advantages

• High logic capacity: 504,000 logic elements provide room for large designs and feature‑rich implementations without immediate migration to a larger device.
• Significant embedded memory: Approximately 27.7 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Large I/O footprint: 544 I/O pins simplify multi‑channel interfacing and reduce the need for external multiplexing logic.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
• Compact, thermally aware package: 1152‑BBGA exposed‑pad FCBGA package supports dense PCB layouts and thermal dissipation strategies.
• Regulatory readiness: RoHS compliance facilitates integration into environmentally regulated supply chains.

Why Choose 5AGXMB7G4F35I5N?

The 5AGXMB7G4F35I5N combines substantial programmable logic, ample on‑chip memory, and a high I/O count in an industrial‑grade FPGA package. Its defined power and thermal characteristics make it straightforward to plan power delivery and thermal management for reliable long‑term operation.

This device is well suited for engineers and system designers building industrial control, high‑channel I/O, and custom signal‑processing systems that require a balance of density, memory, and environmental robustness while remaining within a compact BGA footprint.

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