5CEBA7U19C8N

The 5CEBA7U19C8N is a Cyclone® V E family field-programmable gate array (FPGA) in a 484‑FBGA package optimized for cost-sensitive, high-volume designs. It combines a high logic capacity and substantial embedded memory with a low-voltage core to support complex logic, signal processing, and interface integration.

Targeted at applications that require large gate counts, flexible I/O, and efficient power operation, this commercial‑grade device delivers 149,500 logic elements, approximately 7.88 Mbits of embedded memory, and up to 240 I/O pins in a surface‑mount 484‑UBGA (19×19) package.

Key Features

• Logic Capacity — 149,500 logic elements for implementation of large-scale logic, control, and custom accelerators.
• Embedded Memory — Approximately 7.88 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O and Package — 240 user I/O pins in a 484‑FBGA (supplier package 484‑UBGA, 19×19) surface‑mount package to support rich external interfacing.
• Core Voltage and Power — Operates within a 1.07 V to 1.13 V supply range, consistent with the Cyclone V family’s low‑power 28 nm process and 1.1 V core design.
• Family‑Level Architecture — Built on TSMC’s 28‑nm low‑power (28LP) technology with enhanced 8‑input adaptive logic modules (ALMs) and M10K memory blocks (family feature set referenced from device series documentation).
• Operating Range and Compliance — Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for lead‑free assembly processes.
• Mounting — Surface mount package suitable for automated PCB assembly and high‑density board designs.

Typical Applications

• Communications Equipment — Implement protocol processing, framing, and high‑density I/O handling for wireless and wireline systems where flexible logic and on‑chip memory are required.
• High‑Volume Consumer Electronics — Integrate custom logic, video processing, and interface bridging in cost‑sensitive products that benefit from high logic density and a compact FBGA package.
• Embedded Acceleration — Deploy application‑specific accelerators and data paths using abundant logic elements and embedded RAM for performance and integration in system designs.
• SoC Integration Platforms — Use as the FPGA fabric in systems that combine hard and soft IP to implement control, offload, and glue logic for complex platforms (family features include tight integration capabilities).

Unique Advantages

• High Logic Density: 149,500 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On‑Chip Memory: Approximately 7.88 Mbits of embedded RAM lowers external memory dependency for many buffering and lookup requirements.
• Low‑Voltage Core: Narrow 1.07 V–1.13 V supply window supports designs optimized for low power consumption and aligns with the Cyclone V 28‑nm low‑power process.
• Flexible I/O in Compact Package: 240 I/O in a 484‑FBGA (19×19) package supports dense board layouts while preserving broad interfacing options.
• Commercial Temperature and RoHS Compliance: Defined 0 °C to 85 °C operating range and RoHS compliance simplify qualification for commercial products and manufacturing.

Why Choose 5CEBA7U19C8N?

The 5CEBA7U19C8N positions itself as a high‑capacity, commercially graded Cyclone V E FPGA suited for designs that need a mix of large logic resources, meaningful on‑chip memory, and a compact high‑pin‑count package. Its low‑voltage core and family architecture features make it a practical choice for cost‑sensitive, high‑volume applications that require integration and efficient power use.

Engineers designing complex control logic, protocol processing, or embedded acceleration can leverage this device’s density and memory to reduce external components and streamline system architecture while remaining within a commercial temperature envelope.

Request a quote or submit a procurement inquiry to get pricing and availability for the 5CEBA7U19C8N and support for your design requirements.