5CEBA9F23C7N

The 5CEBA9F23C7N is a Cyclone V E series FPGA in a 484-FBGA (23×23) surface-mount package. It provides a high-density programmable fabric with 301,000 logic elements, extensive on-chip memory, and 224 I/O pins for commercial embedded and high-volume, cost-sensitive applications.

Built on the Cyclone V device architecture, this part targets applications that require a balance of logic capacity, integrated memory, low power consumption, and flexible I/O in a compact BGA package.

Key Features

• Logic Capacity — 301,000 logic elements for complex control, signal processing, and glue-logic implementations.
• Embedded Memory — Approximately 13.59 Mbits of on-chip RAM (14,251,008 total RAM bits) to support buffering, tables, and local data storage without external memory.
• I/O and Package — 224 user I/O pins in a 484-FBGA (23×23) package; surface-mount mounting simplifies board-level integration.
• Power and Voltage — Core supply range of 1.07 V to 1.13 V (nominal 1.1 V), compatible with low-voltage system designs.
• Process and Fabric Architecture — Cyclone V family device architecture built on a 28 nm low-power process with enhanced adaptive logic modules and variable-precision DSP blocks (as described in Cyclone V device documentation).
• Transceiver and Memory IP (Device Family) — Cyclone V devices include integrated hard IP such as high-speed transceivers and hard memory controllers (family-level features described in Cyclone V documentation).
• Operating Range and Compliance — Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Wireless and Wireline Communications — Implements protocol logic, packet processing, and interface bridging using high logic density and integrated memory.
• Embedded Control and SoC Glue Logic — Acts as a programmable interface and control hub between processors, sensors, and peripherals in commercial systems.
• High-Volume Consumer and Commercial Products — Suitable for cost-sensitive products requiring significant programmable logic and on-chip memory in a compact BGA footprint.

Unique Advantages

• High Logic Density: 301,000 logic elements enable implementation of large custom logic blocks and complex state machines without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 13.59 Mbits of embedded RAM minimizes reliance on external memory, reducing BOM and board complexity.
• Low-Voltage Operation: Core supply between 1.07 V and 1.13 V supports low-power system architectures and aligns with Cyclone V family low-power design goals.
• Compact BGA Packaging: 484-FBGA (23×23) provides a high pin-count, space-efficient solution for dense board layouts and surface-mount assembly.
• Family-Level Integration: Leverages Cyclone V device architecture features such as enhanced ALMs, DSP blocks, and embedded memory blocks for flexible design tradeoffs (as described in Cyclone V documentation).
• RoHS Compliant: Conforms to RoHS requirements for regulated environments and broad market acceptance.

Why Choose 5CEBA9F23C7N?

The 5CEBA9F23C7N combines a high logic element count, substantial embedded memory, and a 224-pin I/O complement in a compact 484-FBGA package, making it well suited to commercial designs that demand programmable flexibility with minimized external components. Its low-voltage core and Cyclone V family architecture deliver a balance of performance and power efficiency for high-volume applications.

This part is appropriate for engineering teams developing commercial embedded systems, communications interfaces, or any design that benefits from significant on-chip logic and memory in a surface-mount BGA footprint backed by Cyclone V device documentation and feature set.

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