5CEBA9F23C8N

The 5CEBA9F23C8N is a Cyclone® V E field-programmable gate array (FPGA) in a 484-ball BGA package (23 × 23 mm) designed for cost- and power-sensitive designs. It combines a high-density programmable fabric with embedded memory and integrated I/O to address applications that require bandwidth, configurability, and system integration.

Built on TSMC's 28 nm low-power (28LP) process and operating with a core voltage near 1.1 V, this device targets markets such as wireless and wireline communications and industrial systems where power efficiency and FPGA integration are important.

Key Features

• Logic Capacity — 301,000 logic elements provide substantial programmable fabric for custom logic, state machines, and protocol handling.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) for buffering, FIFOs, and local storage.
• I/O and Packaging — 224 general-purpose I/O pins in a 484-FBGA (23×23) surface-mount package, enabling dense board-level integration.
• Process and Core Voltage — Implemented on TSMC 28 nm low-power technology with a 1.1 V core; supply range specified at 1.07 V to 1.13 V for stable operation.
• Integrated System Features — Series-level features include integrated transceivers and hard memory controllers to simplify high-bandwidth interfaces and external memory connectivity.
• Enhanced Logic Architecture — Enhanced 8-input adaptive logic modules (ALMs) and variable-precision DSP block capability reported for Cyclone V family devices.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Typical Applications

• Wireless and Wireline Communications — Implements protocol processing, packet buffering, and interface bridging where integrated transceivers and memory controllers improve throughput.
• Industrial Control Systems — Handles sensor interfacing, motor control logic, and custom real-time processing using the device’s logic capacity and embedded memory.
• High‑density I/O Aggregation — Consolidates multiple I/O channels and protocol translators on a single FPGA thanks to 224 I/O pins and a compact 484-BGA footprint.

Unique Advantages

• High Logic Density: 301,000 logic elements allow implementation of large custom functions without external ASICs or additional FPGAs, reducing board-level complexity.
• Substantial On-chip RAM: Approximately 14.25 Mbits of embedded memory enables local buffering and low-latency data paths for real-time processing.
• Efficient Power Envelope: Manufactured on 28 nm low-power process with a narrow 1.07 V–1.13 V supply window, facilitating predictable power budgeting.
• System Integration: Family-level integration of transceivers and hard memory controllers reduces external component count for high-bandwidth designs.
• Compact, Surface-mount Package: 484-FBGA (23×23) provides a high-pin-count solution in a compact footprint suitable for space-constrained PCBs.
• Commercial Temperature Range: Rated 0 °C to 85 °C for mainstream electronics and embedded systems deployment.

Why Choose 5CEBA9F23C8N?

This Cyclone V E device offers a balance of programmable capacity, embedded memory, and integrated system IP in a compact BGA package. It is well suited to engineers designing mid-to-high density FPGA solutions that need predictable power, substantial local RAM, and a high I/O count without moving to higher-cost device families.

For projects focused on communication interfaces, on-board data buffering, and consolidated logic functions, the 5CEBA9F23C8N delivers a scalable platform with Cyclone V family features and commercial-grade operating specifications supported by RoHS compliance.

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