5CEBA9F31C8N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 1,036 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CEBA9F31C8N – Cyclone® V E Field Programmable Gate Array (FPGA), 301,000 logic elements, 896‑BGA

The 5CEBA9F31C8N is an Intel Cyclone® V E series FPGA offered in an 896‑FBGA (31×31) surface‑mount package. It delivers a high logic capacity FPGA fabric with extensive on‑chip memory and rich I/O density for complex, cost‑sensitive embedded designs.

Targeted at applications that require significant programmable logic and memory within a compact footprint, this device combines large logic capacity, approximately 14.25 Mbits of embedded memory, and 480 user I/O for flexible system integration while operating within a 1.07 V–1.13 V core supply window.

Key Features

  • Logic Capacity — 301,000 logic elements provide the programmable logic resources needed for sizable FPGA designs and complex control logic.
  • Embedded Memory — Approximately 14.25 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage without external memory in many applications.
  • I/O Density — 480 user I/O pins enable broad connectivity to peripherals, sensors, and high‑pin‑count interfaces.
  • Power and Core Voltage — Operates with a defined core supply range of 1.07 V to 1.13 V for consistent power planning and voltage regulation design.
  • Package and Mounting — 896‑FBGA (31×31) package, surface mount, suitable for compact PCB layouts requiring high pin count in a single BGA footprint.
  • Operating Range — Commercial temperature support from 0 °C to 85 °C for typical industrial and consumer electronics environments.
  • Standards Compliance — RoHS compliant to meet common environmental restrictions for electronic components.
  • Series‑level Technology — Cyclone V family devices are built on a 28‑nm low‑power process with architectural features such as enhanced 8‑input adaptive logic modules and DSP/memory resources (series datasheet).

Typical Applications

  • Industrial control — Real‑time control, sensor aggregation, and protocol bridging where high logic density and many I/O are required.
  • Communications equipment — Endpoint and infrastructure functions that benefit from embedded memory and programmable logic for packet processing or protocol adaptation.
  • Imaging and signal processing — On‑chip RAM and logic resources support buffering and pipeline implementations for moderate‑complexity DSP tasks.
  • High‑pin integration systems — Compact, high‑pin‑count designs that require many interfaces in a single BGA footprint for space‑constrained PCBs.

Unique Advantages

  • High programmable capacity: 301,000 logic elements enable large designs and feature integration that reduce the need for additional discrete logic.
  • Substantial on‑chip memory: Approximately 14.25 Mbits of embedded RAM supports data buffering and local storage to simplify external memory requirements.
  • Extensive I/O: 480 user I/O pins provide broad connectivity for multi‑interface systems and peripheral-rich applications.
  • Compact, manufacturable package: 896‑FBGA (31×31) surface‑mount package balances pin count and board space for dense system designs.
  • Defined power envelope: Narrow core voltage range (1.07 V–1.13 V) simplifies power supply design and regulator selection.
  • Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for modern electronic products.

Why Choose 5CEBA9F31C8N?

The 5CEBA9F31C8N combines a large logic fabric, significant embedded memory, and high I/O density in a single, compact BGA package—making it a strong choice for designers who need programmable flexibility without expanding board area or bill of materials. Its commercial operating range and RoHS compliance suit a wide range of consumer and industrial electronics projects.

As part of the Cyclone V family, this device benefits from series‑level architecture and documentation that support migration and development across similar device densities. The defined electrical and thermal specifications simplify system integration and power management for embedded engineering teams.

Request a quote or submit a sales inquiry to obtain pricing, availability, and ordering information for the 5CEBA9F31C8N.

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