5CEBA9U19C7N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 14251008 301000 484-FBGA

Quantity 684 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CEBA9U19C7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 14251008 301000 484-FBGA

The 5CEBA9U19C7N is a Cyclone V E family FPGA in a 484-FBGA (484-UBGA, 19×19) surface-mount package. It combines a high logic capacity and substantial on-chip memory with I/O density and low-power process technology, making it suitable for cost-sensitive, high-bandwidth applications across industrial, wireless/wireline, and military markets.

With 301,000 logic elements, approximately 14.25 Mbits of embedded memory, 240 I/O pins, and a 1.07–1.13 V supply range, this commercial-grade device targets designs that need integrated logic, memory, and I/O in a compact surface-mount package.

Key Features

  • Logic Capacity  301,000 logic elements provide substantial programmable fabric for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 14.25 Mbits of on-chip RAM, with Cyclone V family M10K block support and ECC capability noted in the device family documentation.
  • I/O and Packaging  240 general-purpose I/Os in a 484-FBGA package (supplier package: 484-UBGA, 19×19) optimized for surface-mount assembly.
  • Low-Power Process and Core Voltage  Built on TSMC 28-nm low-power (28LP) technology with a core supply window of 1.07–1.13 V (family nominal core voltage 1.1 V), enabling power-efficient designs.
  • High-Bandwidth Interfaces (family-level)  Cyclone V family devices include integrated transceiver and hard memory controller technology to support multi-gigabit links and high-bandwidth external memory interfaces.
  • DSP and System Integration (family-level)  Variable-precision DSP blocks and optional Hard Processor System (HPS) with Arm Cortex‑A9 are available in the Cyclone V family to support signal processing and SoC partitioning.
  • Commercial Temperature and Compliance  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS-compliant for environmental conformity.

Typical Applications

  • High-bandwidth communications  Leverages integrated transceivers and hard memory controllers (Cyclone V family features) for wired and wireless link processing and protocol offload.
  • Industrial control and instrumentation  Provides programmable logic and on-chip memory for deterministic I/O aggregation, control sequencing, and custom peripheral interfaces.
  • Embedded signal processing  Large logic capacity plus variable-precision DSP resources (family-level) enable real-time DSP functions and data-path acceleration.
  • System-on-chip integration  Use within SoC architectures that combine FPGA fabric with processor subsystems (Cyclone V family HPS) for consolidated system designs.

Unique Advantages

  • High logic and memory density  301,000 logic elements and ~14.25 Mbits of embedded RAM reduce reliance on external resources and help lower BOM complexity.
  • Compact, deployable package  484-FBGA (484-UBGA, 19×19) surface-mount package provides high I/O count in a compact footprint for space-constrained PCBs.
  • Energy-efficient 28 nm platform  TSMC 28-nm low-power process and a narrow core supply range support lower power consumption for sustained deployments.
  • Family-level integration options  Cyclone V family features—such as M10K memory blocks with ECC, DSP blocks, transceivers, and hard memory controllers—allow tailored system partitioning and scalable migration within the device family.
  • Commercial readiness  RoHS-compliant and rated for 0 °C to 85 °C operation for mainstream commercial product lines.

Why Choose 5CEBA9U19C7N?

The 5CEBA9U19C7N delivers a balance of programmable logic capacity, embedded memory, and I/O density in a compact 484-FBGA surface-mount package. It is positioned for designs that require significant on-chip resources while maintaining a commercial-temperature profile and RoHS compliance.

Choose this Cyclone V E device when you need a cost-effective, energy-efficient FPGA platform that aligns with family-level integration options (DSP blocks, transceivers, hard memory controllers, and optional HPS) and offers a clear upgrade path across compatible Cyclone V package footprints.

Request a quote or submit an RFQ for 5CEBA9U19C7N today to check pricing and availability.

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