5CEFA2F23C8N

The 5CEFA2F23C8N is an Intel Cyclone® V E field-programmable gate array (FPGA) supplied in a 484-ball BGA. This commercial-grade, surface-mount device integrates 25,000 logic elements and approximately 1.9 Mbits of embedded RAM to address mid-density programmable logic requirements.

Designed for applications across industrial, wireless/wireline and military markets, the device delivers a compact, power-efficient FPGA foundation with high I/O density and package options that support board-level integration and scalable system designs.

Key Features

• Logic Capacity — 25,000 logic elements suitable for mid-range programmable logic implementations and custom hardware acceleration.
• Embedded Memory — Approximately 1.9 Mbits of on-chip RAM for buffers, state storage, and small lookup tables.
• High I/O Count — 224 user I/Os to support dense peripheral interfaces and multiple external connections.
• Package — 484-BGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly and compact PCB footprints.
• Power — Core voltage range 1.07 V to 1.13 V to match low-voltage system rails and power budgets.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Mounting and Compliance — Surface-mount device with RoHS compliance.
• Cyclone V Series Capabilities — Family-level features described in the Cyclone V device overview include low-power 28 nm process technology, integrated transceivers and hard memory controllers, and optional hard-processor-system (HPS) integration for designs that require processor + FPGA combinations.

Typical Applications

• Industrial Control — Machine control, motion systems, and protocol bridging where mid-range logic capacity and robust I/O counts are required.
• Wireless and Wireline Infrastructure — PHY interfacing, protocol processing, and front-end logic for communications equipment leveraging family-level transceiver and memory controller capabilities.
• Defense and Ruggedized Systems (non-automotive) — Signal processing, data aggregation, and custom I/O conditioning for systems operating within commercial temperature ranges.
• Embedded SoC Prototyping — FPGA-based hardware acceleration and peripheral integration alongside processor subsystems when using Cyclone V family architectures that include HPS options.

Unique Advantages

• Balanced Mid-range Resources — 25,000 logic elements and ~1.9 Mbits of embedded memory provide a balanced resource mix for control, DSP-lite, and glue-logic designs without over-provisioning.
• High I/O Density — 224 I/Os enable multiple external interfaces and high-pin-count peripherals on a single device, reducing the need for external bridge components.
• Compact Surface-Mount Packaging — 484-BGA (23×23) footprint supports dense board layouts and modern assembly processes for space-constrained applications.
• Low-Voltage Core — Narrow core voltage window (1.07–1.13 V) aligns with low-power system designs and simplifies power-supply planning.
• Commercial Temperature Suitability — Rated for 0 °C to 85 °C operation to match a wide range of non-extended-temperature commercial deployments.
• RoHS-Compliant — Meets RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose 5CEFA2F23C8N?

The 5CEFA2F23C8N positions itself as a compact, mid-density FPGA for designers who need a blend of logic, embedded memory, and high I/O count in a commercial-temperature, surface-mount package. Its Cyclone V family lineage brings series-level capabilities—such as integrated transceiver and hard memory controller options and SoC-oriented variants—enabling flexible architectures that can scale across product families.

Choose this device for projects that benefit from a power-efficient core voltage, dense I/O, and a BGA package footprint that supports modern PCB integration, while relying on Intel’s Cyclone V series documentation and ecosystem for development support.

Request a quote or submit an inquiry to check availability and obtain pricing for the 5CEFA2F23C8N.