5CEFA2M13C7N

IC FPGA 223 I/O 383MBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 223 2002944 25000 383-TFBGA

Quantity 1,369 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package383-MBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case383-TFBGANumber of I/O223Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9434Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2002944

Overview of 5CEFA2M13C7N – Cyclone® V E FPGA, 25,000 Logic Elements, 223 I/O, 383-TFBGA

The 5CEFA2M13C7N is a Cyclone® V E field programmable gate array (FPGA) in a 383-TFBGA package, offering a balanced mix of logic, memory, and I/O for commercial embedded designs. It combines 25,000 logic elements with a high I/O count and on-chip RAM to target applications that require moderate fabric density, flexible interfacing, and low-voltage operation.

As part of the Cyclone V family, this device leverages series-level architectural features such as a low-power 28 nm process and enhanced adaptive logic modules to deliver efficient programmable compute alongside integrated system options documented in Cyclone V device materials.

Key Features

  • Logic Capacity  25,000 logic elements for implementing custom logic, control, and processing blocks.
  • Embedded Memory  Approximately 2.00 Mbits of embedded memory (2,002,944 bits) for on-chip buffering, FIFOs, and small memory structures.
  • General Purpose I/O  223 I/O pins to support a wide range of parallel interfaces and external connectivity.
  • Power and Core Voltage  Operates with a supply range of 1.07 V to 1.13 V consistent with the Cyclone V family’s ~1.1 V core operation for low-voltage designs.
  • Package and Mounting  Supplied in a 383-TFBGA package (supplier device package: 383-MBGA, 13×13) with surface-mount construction for compact board-level integration.
  • Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Standards and Compliance  RoHS-compliant to support regulatory and assembly requirements.
  • Cyclone V Family Capabilities  Family-level features include an 8-input adaptive logic module (ALM), support for variable-precision DSP blocks, and low-power 28 nm process technology as documented in Cyclone V device materials.

Typical Applications

  • Industrial Control  Implement motor control algorithms, deterministic I/O handling, and custom timing systems using on-chip logic and memory.
  • Wireless and Wireline Infrastructure  Provide protocol handling, packet processing, and interface bridging where a combination of logic density and flexible I/O is required.
  • Defense and Military Systems  Deploy in commercial-temperature systems requiring moderate FPGA resources for signal processing and control functions.
  • Embedded SoC and Accelerator Functions  Offload custom datapath or pre/post-processing tasks from a host processor using the device’s logic and embedded memory.

Unique Advantages

  • Balanced Logic and Memory: Combines 25,000 logic elements with approximately 2.00 Mbits of embedded RAM to implement mid-density programmable functions without large external memory dependence.
  • High I/O Count: 223 I/O pins enable extensive peripheral and bus connectivity for complex system interfaces.
  • Low-Voltage Operation: Narrow supply window (1.07–1.13 V) aligned with Cyclone V family low-power operation, simplifying core power rail design.
  • Compact Surface-Mount Packaging: 383-TFBGA (383-MBGA, 13×13) package provides a space-efficient form factor for board-level integration.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C to match a wide set of commercial embedded deployments.
  • RoHS Compliance: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose 5CEFA2M13C7N?

The 5CEFA2M13C7N places a practical balance of logic density, embedded memory, and I/O availability into a compact BGA package suitable for commercial embedded systems. Its voltage and temperature specifications, together with Cyclone V family architecture references, make it a suitable choice for designs that require efficient low-voltage operation, flexible interfacing, and moderate on-chip resources.

Designers and procurement teams can rely on the Cyclone V documentation and device materials for implementation guidance and to integrate this FPGA into systems requiring validated family-level features and low-power design considerations.

Request a quote or submit an inquiry to get pricing and lead-time information for the 5CEFA2M13C7N.

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