5CEFA2M13I7N

The 5CEFA2M13I7N is an Intel Cyclone V E field programmable gate array (FPGA) supplied in a 383-TFBGA package. It provides 25,000 logic elements and approximately 2.00 Mbits of embedded RAM, delivering a balance of integration, I/O density, and low-voltage operation for industrial designs. Typical use cases include industrial control, wireless and wireline infrastructure, and military applications where a compact, RoHS-compliant FPGA with industrial temperature range is required.

Key Features

• Logic Capacity — 25,000 logic elements (cells) to implement custom digital logic, state machines, and peripheral control.
• On-Chip Memory — Approximately 2.00 Mbits of embedded RAM for buffering, FIFOs, and small memory-mapped data structures.
• I/O Density — 223 I/O pins to support diverse peripheral interfaces and board-level connectivity options.
• Power and Core Voltage — Operates with a core supply range of 1.07 V to 1.13 V, aligned with Cyclone V family low-voltage operation.
• Process and Architecture — Built on TSMC 28 nm low-power (28LP) process technology and leveraging Cyclone V device architecture elements described in the Cyclone V family documentation.
• Package and Mounting — Supplied in a 383-TFBGA (supplier package: 383-MBGA 13×13) surface-mount package for compact system integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS-compliant for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement motor control logic, sensor interfacing, and deterministic I/O aggregation using the device’s logic elements and 223 I/Os within an industrial temperature range.
• Wireless and Wireline Infrastructure — Leverage on-chip logic and embedded memory for protocol processing, data buffering, and peripheral interfacing in base stations and access equipment.
• Military and Ruggedized Systems — Use the device’s low-voltage operation, compact TFBGA package, and industrial operating range for deployment in constrained or rugged embedded systems.

Unique Advantages

• Balanced Logic and Memory — 25,000 logic elements paired with approximately 2.00 Mbits of embedded RAM enable mixed-control and data-path designs without immediate external memory dependence.
• High I/O Count — 223 I/Os provide broad connectivity for sensors, transceivers, and board-level peripherals, reducing the need for external I/O expanders.
• Low-Voltage Operation — Narrow core voltage range (1.07 V–1.13 V) supports low-power system designs and aligns with Cyclone V family low-power characteristics.
• Compact Surface-Mount Packaging — 383-TFBGA (383-MBGA 13×13) package minimizes board footprint for space-constrained applications.
• Industrial Temperature Support — −40 °C to 100 °C rating enables deployment across a wide range of environmental conditions common to industrial and fielded systems.
• RoHS Compliance — Supports lead-free assembly and regulatory compliance in commercial manufacturing.

Why Choose 5CEFA2M13I7N?

The 5CEFA2M13I7N provides a practical combination of logic capacity, embedded memory, and I/O density in a compact TFBGA package with industrial temperature capability and low-voltage operation. It is suitable for engineers building industrial controllers, communications infrastructure modules, and rugged embedded systems that need a verified Cyclone V device with on-chip resources and RoHS compliance.

This part is positioned for designs that require moderate FPGA resources (around 25k logic elements), ample I/O, and reliable operation across −40 °C to 100 °C, backed by the Cyclone V family documentation and device-level specifications.

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