5CEFA2F23I7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA |
|---|---|
| Quantity | 276 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9434 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2002944 |
Overview of 5CEFA2F23I7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA
The 5CEFA2F23I7N is an Intel Cyclone V E field-programmable gate array offered in a 484-ball BGA package. It is a mid-density FPGA variant in the Cyclone V family, designed for cost- and power-sensitive embedded systems that require flexible logic integration, on-chip memory, and a high pin count for external interfacing.
Key uses include industrial and communications applications where temperature range, I/O density, and on-chip memory capacity are important. The device pairs approximately 25,000 logic elements with roughly 2.00 Mbits of embedded memory and 224 general-purpose I/O pins to address moderate-complexity logic and buffering tasks.
Key Features
- Logic Capacity Approximately 25,000 logic elements suitable for mid-density FPGA designs and complex glue logic or protocol offload tasks.
- Embedded Memory Approximately 2.00 Mbits of on-chip RAM (2,002,944 bits) for data buffering, FIFOs, and local storage.
- I/O Count 224 general-purpose I/O pins to support parallel interfaces, multiple peripherals, and board-level signal routing.
- Power Supply Core supply window of 1.07 V to 1.13 V, consistent with low-voltage Cyclone V core requirements.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
- Package and Mounting Available in a 484-BGA (supplier package 484-FBGA, 23 × 23 mm) surface-mount package for high pin-count, compact board designs.
- RoHS Compliant Lead-free, RoHS-compliant device suitable for modern manufacturing and regulatory requirements.
- Cyclone V Family Architecture Built on the Cyclone V platform (TSMC 28‑nm low-power process) with family-level features such as enhanced adaptive logic modules, embedded memory blocks, and hard IP for memory and transceiver support as documented for Cyclone V devices.
Typical Applications
- Industrial Control Motor control, PLC adjunct logic, and deterministic I/O aggregation where extended temperature range and reliable I/O density are required.
- Communications Infrastructure Protocol bridging, packet buffering, and interface adaptation using on-chip RAM and abundant I/O for board-level connectivity.
- Defense and Test Equipment Mid-density logic integration and flexible I/O mapping for instrumentation, data acquisition, and specialty signal processing tasks.
- Embedded Processing Glue Logic Offloading of peripheral handling, timing conversion, and custom state machines that benefit from the device’s logic capacity and embedded memory.
Unique Advantages
- Right-sized Mid-density FPGA: Approximately 25,000 logic elements and on-chip memory provide a balanced platform for designs that exceed small CPLD capabilities but do not require very high-density devices.
- High I/O Density in a Compact Footprint: 224 I/O pins in a 484-BGA package let you implement multiple interfaces without a large board-area penalty.
- Industrial-ready Thermal Range: Rated −40 °C to 100 °C for deployment in environments with wider temperature swings common to industrial installations.
- Low-voltage Core: A defined core voltage window (1.07–1.13 V) simplifies power-rail design for low-voltage systems.
- RoHS Compliance: Lead-free and RoHS-compliant to support modern manufacturing and regulatory requirements.
- Cyclone V Family Benefits: Access to Cyclone V family architecture advantages—enhanced adaptive logic modules, embedded memory blocks, and family-level hard IP—documented for Cyclone V devices.
Why Choose 5CEFA2F23I7N?
The 5CEFA2F23I7N delivers a practical balance of logic capacity, embedded memory, and I/O resources in a compact 484-BGA surface-mount package tailored for industrial and communications applications. Its defined core-voltage range, RoHS compliance, and industrial temperature rating make it a solid choice for mid-complexity designs where board area, interfacing flexibility, and reliable operation across temperature are priorities.
Designed as part of the Cyclone V family, this device is suited for customers who need scalable FPGA resources, predictable power rails, and the ability to implement local buffering and protocol logic without moving to higher-density, higher-cost devices.
Request a quote or submit an inquiry to purchase the 5CEFA2F23I7N and get pricing, availability, and lead-time details for your design needs.

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