5CEFA2F23I7N

IC FPGA 224 I/O 484FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA

Quantity 276 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9434Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2002944

Overview of 5CEFA2F23I7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA

The 5CEFA2F23I7N is an Intel Cyclone V E field-programmable gate array offered in a 484-ball BGA package. It is a mid-density FPGA variant in the Cyclone V family, designed for cost- and power-sensitive embedded systems that require flexible logic integration, on-chip memory, and a high pin count for external interfacing.

Key uses include industrial and communications applications where temperature range, I/O density, and on-chip memory capacity are important. The device pairs approximately 25,000 logic elements with roughly 2.00 Mbits of embedded memory and 224 general-purpose I/O pins to address moderate-complexity logic and buffering tasks.

Key Features

  • Logic Capacity  Approximately 25,000 logic elements suitable for mid-density FPGA designs and complex glue logic or protocol offload tasks.
  • Embedded Memory  Approximately 2.00 Mbits of on-chip RAM (2,002,944 bits) for data buffering, FIFOs, and local storage.
  • I/O Count  224 general-purpose I/O pins to support parallel interfaces, multiple peripherals, and board-level signal routing.
  • Power Supply  Core supply window of 1.07 V to 1.13 V, consistent with low-voltage Cyclone V core requirements.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
  • Package and Mounting  Available in a 484-BGA (supplier package 484-FBGA, 23 × 23 mm) surface-mount package for high pin-count, compact board designs.
  • RoHS Compliant  Lead-free, RoHS-compliant device suitable for modern manufacturing and regulatory requirements.
  • Cyclone V Family Architecture  Built on the Cyclone V platform (TSMC 28‑nm low-power process) with family-level features such as enhanced adaptive logic modules, embedded memory blocks, and hard IP for memory and transceiver support as documented for Cyclone V devices.

Typical Applications

  • Industrial Control  Motor control, PLC adjunct logic, and deterministic I/O aggregation where extended temperature range and reliable I/O density are required.
  • Communications Infrastructure  Protocol bridging, packet buffering, and interface adaptation using on-chip RAM and abundant I/O for board-level connectivity.
  • Defense and Test Equipment  Mid-density logic integration and flexible I/O mapping for instrumentation, data acquisition, and specialty signal processing tasks.
  • Embedded Processing Glue Logic  Offloading of peripheral handling, timing conversion, and custom state machines that benefit from the device’s logic capacity and embedded memory.

Unique Advantages

  • Right-sized Mid-density FPGA: Approximately 25,000 logic elements and on-chip memory provide a balanced platform for designs that exceed small CPLD capabilities but do not require very high-density devices.
  • High I/O Density in a Compact Footprint: 224 I/O pins in a 484-BGA package let you implement multiple interfaces without a large board-area penalty.
  • Industrial-ready Thermal Range: Rated −40 °C to 100 °C for deployment in environments with wider temperature swings common to industrial installations.
  • Low-voltage Core: A defined core voltage window (1.07–1.13 V) simplifies power-rail design for low-voltage systems.
  • RoHS Compliance: Lead-free and RoHS-compliant to support modern manufacturing and regulatory requirements.
  • Cyclone V Family Benefits: Access to Cyclone V family architecture advantages—enhanced adaptive logic modules, embedded memory blocks, and family-level hard IP—documented for Cyclone V devices.

Why Choose 5CEFA2F23I7N?

The 5CEFA2F23I7N delivers a practical balance of logic capacity, embedded memory, and I/O resources in a compact 484-BGA surface-mount package tailored for industrial and communications applications. Its defined core-voltage range, RoHS compliance, and industrial temperature rating make it a solid choice for mid-complexity designs where board area, interfacing flexibility, and reliable operation across temperature are priorities.

Designed as part of the Cyclone V family, this device is suited for customers who need scalable FPGA resources, predictable power rails, and the ability to implement local buffering and protocol logic without moving to higher-density, higher-cost devices.

Request a quote or submit an inquiry to purchase the 5CEFA2F23I7N and get pricing, availability, and lead-time details for your design needs.

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