5CEFA2M13C6N

IC FPGA 223 I/O 383MBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 223 2002944 25000 383-TFBGA

Quantity 1,090 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package383-MBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case383-TFBGANumber of I/O223Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9434Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2002944

Overview of 5CEFA2M13C6N – Cyclone V E FPGA, 25,000 logic elements, 383‑TFBGA

The 5CEFA2M13C6N is an Intel Cyclone® V E family field programmable gate array (FPGA) offered in a 383‑TFBGA package. It provides a mid-range logic fabric with 25,000 logic elements and approximately 2.00 Mbits of embedded memory for control, bridging, and moderate-density signal processing tasks.

Built on the Cyclone V family architecture and TSMC 28‑nm low‑power process, the device targets commercial applications where low core voltage operation, high I/O count, and compact BGA packaging are important design constraints.

Key Features

  • Logic Capacity  25,000 logic elements, suitable for mid-density FPGA implementations and custom logic partitioning.
  • Embedded Memory  Approximately 2.00 Mbits of on‑chip RAM (2,002,944 bits) for buffering, FIFOs, and local storage.
  • I/O Resources  223 total I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
  • Process & Core Voltage  Cyclone V family architecture built on a 28‑nm low‑power process with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
  • Family Connectivity Options  Cyclone V device family includes integrated transceiver and hard IP options (family‑level feature set referenced in documentation) for high‑bandwidth interfaces.
  • Package & Mounting  383‑TFBGA (supplier package: 383‑MBGA, 13×13 mm); surface‑mount device for compact board designs.
  • Operating Range  Commercial grade device with operating temperature 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial control and automation  Use the device’s logic density and on‑chip memory for control functions, protocol translation, and deterministic I/O handling in commercial automation systems.
  • Wireless and wireline infrastructure  Leverage the Cyclone V family connectivity features and sizable I/O to implement packet handling, framing, and interface bridging in communication equipment.
  • Military and ruggedized commercial systems  Deploy the FPGA’s configurable logic and memory resources for custom signal conditioning, custom state machines, and system interfacing in non‑automotive defense or mission equipment.

Unique Advantages

  • Right‑sized logic density: 25,000 logic elements provide a balance of capacity and cost for mid‑range designs without overprovisioning.
  • On‑chip memory for local buffering: Approximately 2.00 Mbits of embedded RAM reduce external memory needs and simplify board-level designs for many control and dataflow tasks.
  • High I/O count: 223 I/O pins enable broad peripheral support and flexible interface mapping on compact PCBs.
  • Low‑voltage core operation: 1.07–1.13 V supply range aligns with the Cyclone V family’s low‑power 28‑nm process, aiding power‑sensitive commercial designs.
  • Compact BGA package: 383‑TFBGA (13×13) helps minimize PCB area while maintaining signal integrity for dense designs.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose 5CEFA2M13C6N?

The 5CEFA2M13C6N positions itself as a practical Cyclone V E FPGA option for commercial designs that require a balanced mix of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its low‑voltage core operation and family‑level feature set make it appropriate for applications where power efficiency and integration are priorities.

This part is well suited to engineering teams designing mid‑density control systems, communication endpoints, and custom interface logic who need predictable operating conditions and RoHS compliance backed by Cyclone V family documentation.

If you would like pricing or availability for 5CEFA2M13C6N, request a quote or submit a pricing inquiry to evaluate this FPGA for your next design.

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