5CEFA2F23C7N

The 5CEFA2F23C7N is a Cyclone V E series FPGA in a 484-ball FBGA package designed for cost- and power-sensitive embedded applications. The device combines a fabric optimized for logic and memory integration with series-level features from the Cyclone V family to address industrial, wireless and wireline system requirements.

Key on-device specifications include 25,000 logic elements, approximately 2.00 Mbits of embedded memory, 224 I/O pins, and a compact 484-FBGA (23×23) package. The device is specified for commercial operation (0 °C to 85 °C) and is RoHS compliant.

Key Features

• FPGA Fabric and Core  Cyclone V architecture built on TSMC 28-nm low-power process technology with a nominal core voltage around 1.1 V (device supply specified at 1.07 V to 1.13 V).
• Logic Capacity  25,000 logic elements to implement combinational and sequential logic for control, protocol handling, and custom datapaths.
• Embedded Memory  Approximately 2.00 Mbits of on-chip RAM (2,002,944 bits) for buffering, LUT-based storage, and small data structures.
• I/O and Package  224 user I/O pins in a 484-FBGA (23×23) package, surface-mount mounting type, enabling dense board integration and flexible interfacing.
• Power and Thermal  Core supply range specified between 1.07 V and 1.13 V; commercial-grade operating temperature from 0 °C to 85 °C.
• Series-Level Integration  Cyclone V family features include an enhanced adaptive logic module, M10K embedded memory blocks, variable-precision DSP resources, transceivers and hard memory controllers as documented in the Cyclone V device overview.
• Compliance  RoHS-compliant lead-free device suitable for commercial-volume production.

Typical Applications

• Industrial Control and Automation  Use the FPGA for motor control, I/O aggregation, and deterministic logic functions where a compact, surface-mount programmable device is required.
• Wireless and Wireline Infrastructure  Implement protocol processing, interface bridging, and datapath acceleration leveraging on-chip logic and embedded memory.
• Embedded Systems and SoC Acceleration  Offload custom accelerators, signal preprocessing, and peripheral glue logic to a single-chip programmable fabric with abundant I/O.

Unique Advantages

• Balanced integration of logic and memory: 25,000 logic elements paired with ~2.00 Mbits of embedded RAM allow compact implementation of control and moderate-data buffering functions.
• Low-voltage core operation: Tight core supply range (1.07 V–1.13 V) aligned with 28-nm low-power technology helps manage overall system power.
• Compact, board-friendly package: 484-FBGA (23×23) surface-mount package supports high I/O density (224 pins) in a small footprint.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream production environments.
• Series-level IP and infrastructure: Access to Cyclone V device features such as enhanced ALMs, M10K memory blocks, DSP resources, transceivers, and hard memory controllers for system-level design flexibility.

Why Choose 5CEFA2F23C7N?

5CEFA2F23C7N delivers a practical combination of logic density, embedded memory, and high I/O count in a surface-mount 484-FBGA package for commercial embedded designs. Its specification targets applications that require a programmable, low-voltage core with series-level Cyclone V capabilities for efficient implementation of control, interface, and moderate datapath functions.

This part is well suited for teams seeking an FPGA platform that balances integration and board-level density while leveraging the Cyclone V device family features and ecosystem for scalable development and migration across densities.

Request a quote for 5CEFA2F23C7N to check current pricing and availability for your design and production needs.