5CEFA2F23I7

The 5CEFA2F23I7 is a Cyclone® V E field-programmable gate array (FPGA) offered in a 484‑ball fine‑pitch BGA. It provides a mid-density FPGA fabric with approximately 25,000 logic elements and approximately 2.00 Mbits of embedded memory, targeting cost‑sensitive, performance‑aware embedded applications.

Designed for industrial, wireless/wireline and military market segments, this device pairs a low-voltage core operating range with a compact surface-mount 484‑FBGA package to support space-constrained boards and rugged temperature requirements.

Key Features

• Logic Capacity  Approximately 25,000 logic elements for implementing control logic, glue logic, and moderate FPGA-based acceleration.
• Embedded Memory  Approximately 2.00 Mbits of on-chip RAM suitable for buffers, small lookup tables, and state storage.
• I/O Density  224 general-purpose I/O pins to support dense peripheral interfacing and multiple high-pin-count connectors.
• Power and Voltage  Low-voltage core operation with a specified supply range of 1.07 V to 1.13 V, enabling designs that prioritize energy efficiency.
• Package & Mounting  484‑FBGA (23 × 23) package optimized for surface-mount assembly and compact system integration.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in demanding environmental conditions.
• RoHS Compliance  Manufactured to RoHS standards for regulatory compliance in modern electronic products.
• Cyclone V Family Capabilities  As part of the Cyclone V family, the device benefits from family-level features such as TSMC 28‑nm low-power process technology, integrated hard IP options, and enhancements that target lower power consumption and higher integration.

Typical Applications

• Industrial Control  Motor control, PLC interfaces, and factory automation where industrial temperature range and a compact BGA footprint are required.
• Wireless and Wireline Systems  Protocol handling, framing, and custom logic blocks for wireless baseband front‑ends and wireline data processing.
• Embedded Signal Processing  Moderate-throughput signal conditioning and buffering using the on-chip memory and programmable logic.
• Military and Ruggedized Electronics  Control and interface logic in systems that need extended temperature operation and robust packaging.

Unique Advantages

• Balanced Logic and Memory  Combines ~25,000 logic elements with ~2.00 Mbits of embedded RAM to implement compact soft processors, control state machines, and local buffering without external memory in many designs.
• High I/O Count in a Compact Package  224 I/Os in a 23 × 23 484‑FBGA footprint support multiple peripheral interfaces while conserving PCB area.
• Low-Voltage Core  Operation near 1.1 V reduces core power draw and simplifies power-supply design for energy-conscious systems.
• Industrial Temperature Capability  Specified −40 °C to 100 °C operation for reliability in harsher environmental conditions.
• Regulatory Compliance  RoHS‑compliant manufacturing aligns with global environmental requirements.
• Family-Level Ecosystem  As a Cyclone V device, designs can leverage family documentation and ecosystem resources for development and migration.

Why Choose 5CEFA2F23I7?

The 5CEFA2F23I7 delivers a pragmatic balance of programmable logic, embedded memory, and I/O density in a compact 484‑FBGA package for industrial and communications applications. Its low-voltage core and industrial temperature rating make it a solid choice for designs that require dependable, energy-efficient FPGA capability without excessive density.

This part is well suited to engineers developing mid-density embedded systems who need reliable operation across temperature extremes, a high I/O count, and the integration advantages of the Cyclone V family.

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