5CEFA2F23C6N

IC FPGA 224 I/O 484FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA

Quantity 289 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9434Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2002944

Overview of 5CEFA2F23C6N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA

The 5CEFA2F23C6N is a Cyclone® V E family FPGA from Intel, delivering mid-range programmable logic capacity with integrated system-level features on a low-power 28 nm process. This device combines approximately 25,000 logic elements, approximately 2.0 Mbits of embedded memory, and 224 I/O pins in a compact 484-BGA package to address high-volume, cost-sensitive designs requiring flexible I/O and on-chip memory.

Built for designers who need an efficient balance of logic density, embedded memory, and connectivity, the device is enhanced with family-level capabilities such as integrated transceivers and hard memory controllers and operates at a nominal core supply near 1.1 V.

Key Features

  • Logic Capacity  Approximately 25,000 logic elements provide mid-range programmable logic for glue logic, custom peripherals, and moderate FPGA acceleration.
  • Embedded Memory  Approximately 2.0 Mbits of on-chip RAM (2,002,944 bits) for buffering, state machines, and small on-device data storage.
  • I/O Density  224 device I/Os support diverse parallel interfaces and board-level connectivity in a single device.
  • Process and Core Voltage  Manufactured on TSMC 28‑nm low‑power (28LP) technology with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
  • Package and Mounting  484‑FBGA (23×23) package, surface‑mount, offering a compact footprint for space-constrained PCBs.
  • Operating Range  Commercial temperature rating from 0 °C to 85 °C suitable for standard temperature environments.
  • Family-Level Integration  Cyclone V devices are enhanced with integrated transceivers, hard memory controllers, and SoC capabilities at the family level to support higher-bandwidth and system integration options.
  • Regulatory Compliance  RoHS‑compliant construction for regulatory and environmental considerations.

Typical Applications

  • Communications Equipment  Use for wireless and wireline interface logic, protocol bridging, or custom packet processing leveraging the family’s transceiver and memory-controller features.
  • Embedded Systems  Ideal for mid-range embedded designs requiring on-chip RAM, flexible I/O and programmable control logic.
  • Consumer and High-Volume Electronics  Fits cost-sensitive, high-volume product lines that need a balance of logic, I/O capability, and compact packaging.
  • Prototyping and Custom IP  A practical platform for prototyping custom accelerators, peripheral controllers, or interface glue logic.

Unique Advantages

  • Balanced Logic and Memory  Approximately 25,000 logic elements paired with ~2.0 Mbits of embedded RAM enables a wide range of mid-density designs without external memory for many use cases.
  • High I/O Count in Compact Package  224 I/Os in a 484‑FBGA (23×23) footprint reduces PCB complexity while keeping board area efficient.
  • Low-Power Process Technology  Built on 28‑nm low‑power silicon with a narrow core supply window to help manage power budgets in dense designs.
  • System-Level Feature Set (Family)  Cyclone V family-level enhancements such as integrated transceivers and hard memory controllers enable higher-bandwidth system integration where needed.
  • Commercial Temperature and RoHS Compliance  Commercial operating range (0 °C to 85 °C) and RoHS compliance simplify qualification for mainstream applications.
  • Manufacturer Support  From Intel, offering design resources and documentation for Cyclone V family devices.

Why Choose 5CEFA2F23C6N?

The 5CEFA2F23C6N Cyclone V E FPGA provides a practical mix of programmable logic, embedded memory, and I/O density in a compact FBGA package for designers targeting mid-range, cost-sensitive products. Its 28 nm low-power construction and family-level system features make it suitable for applications that require configurable logic with efficient power and board-level integration.

Choose this device when you need a commercially rated FPGA with approximately 25,000 logic elements, solid on-chip RAM capacity, and 224 I/Os backed by Intel’s Cyclone V documentation and ecosystem for development and deployment.

If you’d like pricing, lead-time, or a formal quote for 5CEFA2F23C6N, submit a request and our team will respond with availability and ordering options.

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