5CEFA2F23C6N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA |
|---|---|
| Quantity | 289 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9434 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2002944 |
Overview of 5CEFA2F23C6N – Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA
The 5CEFA2F23C6N is a Cyclone® V E family FPGA from Intel, delivering mid-range programmable logic capacity with integrated system-level features on a low-power 28 nm process. This device combines approximately 25,000 logic elements, approximately 2.0 Mbits of embedded memory, and 224 I/O pins in a compact 484-BGA package to address high-volume, cost-sensitive designs requiring flexible I/O and on-chip memory.
Built for designers who need an efficient balance of logic density, embedded memory, and connectivity, the device is enhanced with family-level capabilities such as integrated transceivers and hard memory controllers and operates at a nominal core supply near 1.1 V.
Key Features
- Logic Capacity Approximately 25,000 logic elements provide mid-range programmable logic for glue logic, custom peripherals, and moderate FPGA acceleration.
- Embedded Memory Approximately 2.0 Mbits of on-chip RAM (2,002,944 bits) for buffering, state machines, and small on-device data storage.
- I/O Density 224 device I/Os support diverse parallel interfaces and board-level connectivity in a single device.
- Process and Core Voltage Manufactured on TSMC 28‑nm low‑power (28LP) technology with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
- Package and Mounting 484‑FBGA (23×23) package, surface‑mount, offering a compact footprint for space-constrained PCBs.
- Operating Range Commercial temperature rating from 0 °C to 85 °C suitable for standard temperature environments.
- Family-Level Integration Cyclone V devices are enhanced with integrated transceivers, hard memory controllers, and SoC capabilities at the family level to support higher-bandwidth and system integration options.
- Regulatory Compliance RoHS‑compliant construction for regulatory and environmental considerations.
Typical Applications
- Communications Equipment Use for wireless and wireline interface logic, protocol bridging, or custom packet processing leveraging the family’s transceiver and memory-controller features.
- Embedded Systems Ideal for mid-range embedded designs requiring on-chip RAM, flexible I/O and programmable control logic.
- Consumer and High-Volume Electronics Fits cost-sensitive, high-volume product lines that need a balance of logic, I/O capability, and compact packaging.
- Prototyping and Custom IP A practical platform for prototyping custom accelerators, peripheral controllers, or interface glue logic.
Unique Advantages
- Balanced Logic and Memory Approximately 25,000 logic elements paired with ~2.0 Mbits of embedded RAM enables a wide range of mid-density designs without external memory for many use cases.
- High I/O Count in Compact Package 224 I/Os in a 484‑FBGA (23×23) footprint reduces PCB complexity while keeping board area efficient.
- Low-Power Process Technology Built on 28‑nm low‑power silicon with a narrow core supply window to help manage power budgets in dense designs.
- System-Level Feature Set (Family) Cyclone V family-level enhancements such as integrated transceivers and hard memory controllers enable higher-bandwidth system integration where needed.
- Commercial Temperature and RoHS Compliance Commercial operating range (0 °C to 85 °C) and RoHS compliance simplify qualification for mainstream applications.
- Manufacturer Support From Intel, offering design resources and documentation for Cyclone V family devices.
Why Choose 5CEFA2F23C6N?
The 5CEFA2F23C6N Cyclone V E FPGA provides a practical mix of programmable logic, embedded memory, and I/O density in a compact FBGA package for designers targeting mid-range, cost-sensitive products. Its 28 nm low-power construction and family-level system features make it suitable for applications that require configurable logic with efficient power and board-level integration.
Choose this device when you need a commercially rated FPGA with approximately 25,000 logic elements, solid on-chip RAM capacity, and 224 I/Os backed by Intel’s Cyclone V documentation and ecosystem for development and deployment.
If you’d like pricing, lead-time, or a formal quote for 5CEFA2F23C6N, submit a request and our team will respond with availability and ordering options.

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