5CEBA9F31C7N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 681 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CEBA9F31C7N – Cyclone® V E FPGA, 301,000 logic elements, 480 I/O, 896-BGA

The 5CEBA9F31C7N is an Intel Cyclone® V E field-programmable gate array (FPGA) supplied in a 896-BGA (896-FBGA, 31 × 31) surface-mount package. Built on TSMC's 28 nm low-power process and featuring integrated transceivers and hard memory controllers (Cyclone V family capabilities), this device targets cost- and power-sensitive applications that require substantial programmable logic and on-chip memory.

With 301,000 logic elements, approximately 14.25 Mbits of embedded memory, and up to 480 I/O, the device supports dense, high-functionality designs across industrial, wireless and wireline, and military markets where commercial-grade operation (0 °C to 85 °C) and RoHS compliance are required.

Key Features

  • Process and Core — TSMC 28 nm low-power technology with a nominal core supply range of 1.07 V to 1.13 V (1.1 V core), enabling reduced static and dynamic power for high-density designs.
  • Logic Resources — 301,000 logic elements to implement large, complex digital functions and custom hardware acceleration.
  • Embedded Memory — Approximately 14.25 Mbits of on-chip RAM with Cyclone V family memory architectures (including M10K blocks and ECC options referenced in the device family documentation).
  • DSP and ALM — Family-level features include enhanced 8-input adaptive logic modules and variable-precision DSP blocks for arithmetic and signal processing workloads.
  • I/O and Packaging — Up to 480 general-purpose I/O pins in a 896-FBGA (31 × 31) surface-mount package for high-density board-level interfacing.
  • Integrated High-Speed Interfaces — Cyclone V family documentation references integrated transceivers and hard memory controllers to support high-bandwidth external interfaces.
  • Operating Range and Compliance — Commercial-grade operation from 0 °C to 85 °C and RoHS-compliant supply status.

Typical Applications

  • Industrial equipment — Use in control systems and instrumentation that benefit from high logic counts, embedded memory, and low-power operation.
  • Wireless and wireline systems — Deploy where integrated transceivers and high-bandwidth memory interfaces are advantageous for data transport and protocol processing.
  • Defense and military systems — Applicable to selected military designs that leverage substantial programmable logic and on-chip memory (note: device grade is Commercial; verify system-level qualification requirements).

Unique Advantages

  • High-density programmable fabric — 301,000 logic elements provide capacity for complex control, signal-processing, and protocol-implementation tasks without immediate need for external ASICs.
  • Substantial on-chip memory — Approximately 14.25 Mbits of embedded RAM reduces dependence on external memory for many application architectures, simplifying board design.
  • Robust I/O in a compact package — 480 I/O in a 896-FBGA (31 × 31) offers a balance of connectivity and board-space efficiency for high-pin-count designs.
  • Low-voltage core operation — Narrow core supply range (1.07 V–1.13 V) supports low-power system designs when combined with the 28 nm low-power process.
  • Family-level integration options — Cyclone V family features such as integrated transceivers, hard memory controllers, adaptive logic modules, and variable-precision DSP blocks enable system consolidation and reduced BOM.
  • Regulatory and manufacturing readiness — Surface-mount 896-FBGA package and RoHS compliance facilitate volume manufacturing and regulatory alignment.

Why Choose 5CEBA9F31C7N?

The 5CEBA9F31C7N delivers a high-capacity, low-power FPGA solution in a compact 896-BGA package. Its combination of 301,000 logic elements, approximately 14.25 Mbits of embedded memory, and up to 480 I/O makes it well-suited for commercial applications that require significant programmable resources and on-chip storage while maintaining power efficiency and a small board footprint.

This device is appropriate for development teams and procurement groups building medium- to high-complexity digital systems in industrial, wireless/wireline, and select military applications who need a commercially graded, RoHS-compliant FPGA with strong family-level integration features.

Request a quote or submit a procurement inquiry to receive pricing and availability for 5CEBA9F31C7N.

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