5CEFA2U19A7N

The 5CEFA2U19A7N is a Cyclone® V E series field-programmable gate array (FPGA) supplied in a 484‑FBGA (484‑UBGA, 19×19) package. It integrates 25,000 logic elements with approximately 2.00 Mbits of on-chip RAM and 224 general-purpose I/O to address complex programmable logic tasks in space- and cost-constrained designs.

Built on the Cyclone V family architecture, the device targets applications that require lower power consumption, high integration and a balance of logic, memory and I/O resources. It is qualified to AEC‑Q100 and specified for automotive-grade operation across –40 °C to 125 °C.

Key Features

• Logic Capacity  25,000 logic elements provide the programmable fabric required for control, signal processing and glue-logic integration.
• Embedded Memory  Approximately 2.00 Mbits of on-chip RAM (total RAM bits: 2,002,944) for buffers, FIFOs and local storage close to logic.
• I/O Density  224 general-purpose I/O pins to interface with sensors, peripherals and external devices.
• Power and Core Voltage  Designed around a low-power 1.1 V core architecture with an operating supply range specified at 1.07 V to 1.13 V.
• Automotive Qualification  AEC‑Q100 qualification and Automotive grade designation enable use in applications requiring qualified components and extended temperature performance (–40 °C to 125 °C).
• Package and Mounting  484‑FBGA (supplier device package 484‑UBGA, 19×19), surface-mount construction for PCB assembly in production environments.
• RoHS Compliance  Lead‑free, RoHS-compliant device construction for regulatory and manufacturing compatibility.
• Cyclone V Family Capabilities  Family-level features include 28‑nm low-power process technology, enhanced adaptive logic modules, embedded memory block types (M10K) and variable-precision DSP blocks as part of the Cyclone V device architecture.

Typical Applications

• Industrial systems  Suitable for industrial designs where a balance of programmable logic, memory and I/O density is required while addressing power and cost constraints.
• Wireless and wireline equipment  Deployable in communication infrastructure requiring integrated logic and memory resources to handle protocol and data-path processing.
• Military applications  Appropriate for military use cases that leverage Cyclone V family architecture for integration and performance within defined environmental limits.
• Automotive electronics  AEC‑Q100 qualification and automotive grade designation make this device suitable for selected automotive electronic subsystems operating across the specified temperature range.

Unique Advantages

• Qualified for automotive use  AEC‑Q100 qualification and an automotive grade classification provide a clear path for designs requiring component-level automotive qualification.
• Balanced integration  Combines 25,000 logic elements, ~2.00 Mbits of on-chip RAM and 224 I/O in a single 484‑FBGA package to reduce board-level complexity and BOM count.
• Low-voltage core operation  Narrow core supply window (1.07–1.13 V) and family-level 1.1 V core architecture support efficient power domains and predictable power budgeting.
• Industrial temperature range  Specified operation from –40 °C to 125 °C covers a wide range of deployment environments where temperature resilience is required.
• Regulatory and assembly readiness  Surface-mount 484‑FBGA package and RoHS compliance simplify integration into high-volume manufacturing processes.

Why Choose 5CEFA2U19A7N?

The 5CEFA2U19A7N positions Cyclone V E FPGA capability in a compact, automotive‑qualified package that balances logic density, embedded memory and I/O for cost-sensitive, high‑integration designs. Its AEC‑Q100 qualification and extended temperature range make it a practical option for customers requiring qualified components for automotive and demanding environments.

Designers seeking a low-voltage, RoHS-compliant FPGA with proven Cyclone V family attributes—such as enhanced adaptive logic modules, embedded memory blocks and DSP resources—will find this device suitable for projects needing a mix of programmable logic, local RAM and I/O density in a 484‑FBGA form factor.

Request a quote or submit a pricing and availability inquiry to initiate procurement or to get detailed ordering information for this part.