5SGSED6K2F40I3L

The 5SGSED6K2F40I3L is a Stratix® V GS field programmable gate array (FPGA) supplied by Intel, offered in an industrial temperature grade and packaged in a 1517-BBGA FCBGA (1517-FBGA, 40×40) surface-mount package. It delivers very large logic capacity, substantial on-chip memory, and a high I/O count for designs that require dense programmable logic and extensive peripheral connectivity.

As a member of the Stratix V GS family, this device aligns with the Stratix V device characteristics documented in the device datasheet, including availability in industrial speed grades. The device’s documented electrical and environmental specifications support deployment across a wide operating temperature range and low-voltage core operation.

Key Features

• Core Logic Approximately 583,000 logic elements for complex, high-density logic implementation.
• Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Capacity Up to 696 user I/O pins to support extensive peripheral and interface connectivity.
• Package and Mounting 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Power Documented core voltage supply range of 820 mV to 880 mV for low-voltage core operation.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for robust deployment in thermally demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital logic implementations — Use where large programmable logic resources and embedded RAM are required to implement complex state machines, datapaths, or custom accelerators.
• Multi-channel I/O systems — Suitable for designs that need a high number of user I/O signals (up to 696) for parallel interfaces or multi-port connectivity.
• Industrial embedded systems — Industrial temperature rating and surface-mount FCBGA packaging make the device appropriate for rugged embedded deployments across a wide temperature range.

Unique Advantages

• High logic capacity: Large logic-element count enables consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory minimizes external memory dependence for many buffering and storage needs.
• Extensive I/O: 696 I/O pins provide flexibility to connect numerous peripherals, interfaces, and parallel channels without additional bridging logic.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact FCBGA package: 1517-FBGA (40×40) surface-mount package balances high pin count with compact PCB footprint.
• Low-voltage core operation: Documented 820–880 mV supply range supports designs constrained by low-voltage power domains.

Why Choose 5SGSED6K2F40I3L?

The 5SGSED6K2F40I3L delivers a combination of high logic density, significant embedded memory, and a large I/O complement in an industrial-grade FCBGA package. It is positioned for engineers and teams that need to integrate complex programmable logic and substantial on-chip resources into compact, temperature-tolerant designs.

Choosing this Stratix V GS device can reduce external component count and simplify system architecture for demanding embedded and industrial applications while leveraging Intel’s Stratix V device family documentation and support for device-level electrical and switching characteristics.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGSED6K2F40I3L.