5SGSED6K2F40I3LN

The 5SGSED6K2F40I3LN is an Intel Stratix V GS FPGA in a 1517-BBGA (40×40 FCBGA) package. It provides a large, integrated programmable fabric with extensive I/O and embedded memory, targeted at designs that require substantial on-chip logic density and flexible I/O capacity.

With 583,000 logic elements and approximately 46.08 Mbits of embedded RAM, this industrial-grade device is suitable for systems that must operate across a broad temperature range and at a defined core voltage range.

Key Features

• Logic Capacity – 583,000 logic elements and 220,000 LABs provide large-scale programmable logic resources for complex designs.
• On-chip Memory – Approximately 46.08 Mbits of embedded RAM for buffering, lookup tables, and state storage directly on-chip.
• I/O Count – 696 I/O pins to support wide parallel interfaces, multiple protocols, and extensive board-level connectivity.
• Power – Core voltage supply specified at 820 mV to 880 mV to match system power-rail planning and power budgeting requirements.
• Package – 1517-BBGA, FCBGA (supplier package: 1517-FBGA, 40×40) for high-pin-count, dense board integration.
• Temperature & Grade – Industrial grade with operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Regulatory – RoHS compliant, supporting environmental and material-conformance requirements.

Typical Applications

• High-density logic consolidation – Use the device to implement large, consolidated digital functions where hundreds of thousands of logic elements are required.
• Protocol bridging and complex I/O – Leverage 696 I/O pins for multi-protocol interfacing, wide parallel buses, and board-level connectivity.
• On-chip buffering and data handling – Embedded RAM (≈46.08 Mbits) supports packet buffering, FIFOs, and in-line data processing.
• Industrial control systems – Industrial-grade temperature range and robust packaging make this FPGA suitable for control and automation equipment operating across wide temperatures.

Unique Advantages

• Large programmable fabric: 583,000 logic elements enable integration of complex algorithms and multiple subsystems into a single device, reducing component count.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for latency-sensitive buffering.
• Extensive I/O availability: 696 I/O pins allow flexible interface routing and support for dense connector requirements.
• Industrial operating range: Rated from –40 °C to 100 °C for deployment in temperature-variable environments without additional temperature qualification statements.
• Compact high-pin-count package: 1517-BBGA (40×40 FCBGA) balances high I/O density with board-level footprint considerations.
• Material compliance: RoHS status is compliant, supporting environmental and supply-chain requirements.

Why Choose 5SGSED6K2F40I3LN?

The 5SGSED6K2F40I3LN combines a high logic element count, abundant on-chip RAM, and a large I/O complement in an industrial-grade Stratix V GS FPGA package. These measurable characteristics make it well suited for designs that consolidate multiple digital functions, implement complex data paths, or require substantial buffering and interfacing on a single device.

For engineering teams focused on scalability and robustness, this device offers a clear, specification-driven foundation: predictable core voltage range (820–880 mV), wide operating temperature window (–40 °C to 100 °C), and a high-density 1517-BBGA footprint—backed by Intel’s Stratix V device family documentation.

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