5SGSED6K3F40C2L

The 5SGSED6K3F40C2L is an Intel Stratix V GS field-programmable gate array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This GS-class Stratix V device combines a large programmable fabric with abundant variable-precision DSP resources and integrated high-speed transceivers, targeting transceiver-based, DSP-centric and data-intensive designs.

Built on Stratix V series architecture, the device is optimized for applications that require substantial DSP throughput, high I/O density, and on-chip embedded memory while operating within a commercial temperature range and a core supply window of 820 mV to 880 mV.

Key Features

• Logic Capacity — Approximately 583,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffering, packet storage, and algorithm state.
• DSP Resources — Variable-precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing tasks.
• High-Speed Transceivers — Integrated transceivers with up to 14.1‑Gbps data-rate capability for backplane and optical interfaces (Stratix V GS variant).
• I/O Density & Package — 696 user I/Os in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package to support dense board-level connectivity.
• Core Supply — Operates from 820 mV to 880 mV, matching the device’s core voltage requirements.
• Process & Fabric — Stratix V family architecture built on 28‑nm process technology with adaptive logic modules (ALMs), M20K memory blocks, and comprehensive fabric clocking.
• Operating Grade — Commercial grade operation across 0 °C to 85 °C.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High-Performance Computing — Implements compute- and DSP-intensive kernels using abundant DSP blocks and on-chip memory for low-latency processing.
• Telecommunications and Networking — Supports backplane and optical interfaces leveraging integrated 14.1‑Gbps transceivers and dense I/O for packet processing and transport functions.
• Broadcast and Signal Processing — Handles demanding real-time signal chains with variable-precision multipliers and large embedded RAM for frame buffering and filtering.
• Military and Wireline Systems — Deploys transceiver-enabled DSP applications where configurable logic and high I/O count are required within a commercial temperature envelope.

Unique Advantages

• Large Programmable Fabric: Approximately 583,000 logic elements provide headroom for complex SoC-style designs and multi-function implementations.
• Extensive DSP Capability: Variable-precision DSP blocks (up to 3,926 18×18 multipliers) enable efficient implementation of multiply-intensive algorithms without external accelerators.
• High-Speed Connectivity: Integrated 14.1‑Gbps transceivers simplify high-bandwidth interface design and reduce external serialization requirements.
• Substantial On-Chip Memory: Approximately 46.08 Mbits of embedded memory supports buffering, look-up tables, and large state machines on-chip.
• High I/O Count in Compact Package: 696 I/Os in a 1517-BBGA surface-mount package allow dense board-level routing while maintaining a compact footprint.
• Commercial Temperature & RoHS Compliance: Designed for commercial deployment (0 °C to 85 °C) and RoHS-compliant manufacturing flows.

Why Choose 5SGSED6K3F40C2L?

The 5SGSED6K3F40C2L pairs a large logic fabric and substantial on-chip memory with a sizable complement of variable-precision DSP blocks and integrated transceivers, making it well suited for transceiver-driven DSP and data-intensive applications. Its package and I/O density support complex board-level connectivity while the specified core supply and commercial operating range fit common embedded system requirements.

For teams prototyping DSP-centric, networking, or high-throughput designs that may later migrate to an ASIC path, this Stratix V GS device offers architecture-level features and building blocks consistent with the Stratix V family roadmap.

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