5SGSED6K3F40C2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 11 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K3F40C2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSED6K3F40C2LG is a Stratix V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large programmable fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory, suitable for complex, high-density digital designs.
With 696 available I/O, a surface-mount 1517-FBGA (40×40) supplier package, and a specified operating voltage range of 0.820–0.880 V, this commercial-grade device targets designs that require substantial logic, sizeable on-chip RAM, and high I/O integration within a compact BGA footprint.
Key Features
- Programmable Logic: 583,000 logic elements (cells) to implement large-scale combinational and sequential logic networks.
- Embedded Memory: Total on-chip RAM of 46,080,000 bits (approximately 46 Mbits) for buffering, LUTs, and memory-intensive functions.
- I/O Density: 696 I/O pins to support wide parallel interfaces and extensive external device connectivity.
- Power Supply: Voltage supply range of 0.820–0.880 V, enabling designs that adhere to the device's defined supply window.
- Package & Mounting: 1517-BBGA, FCBGA package in a supplier-specified 1517-FBGA (40×40) format; surface-mount mounting type for PCB integration.
- Operating Environment: Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance: RoHS compliant for regulatory and environmental requirements.
Typical Applications
- High-density digital processing: Implement complex logic blocks and custom datapaths using the device's 583,000 logic elements and sizable embedded RAM.
- Multi-channel I/O systems: Use the 696 I/O pins to aggregate and interface with multiple parallel buses, sensors, or peripherals.
- Memory-intensive algorithms: Leverage approximately 46 Mbits of on-chip RAM for buffering, packet handling, or intermediate storage in real-time processing tasks.
Unique Advantages
- Large programmable fabric: 583,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing board-level component count.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM supports memory-hungry algorithms without immediate reliance on external memory.
- High I/O count: 696 I/O pins enable broad external connectivity and flexible interface topologies.
- Compact BGA footprint: 1517-BBGA (1517-FBGA, 40×40) package balances high integration with a surface-mount form factor suitable for dense PCBs.
- Commercial temperature range: Rated 0 °C to 85 °C for mainstream electronic applications.
- RoHS compliant: Meets environmental compliance expectations for modern electronic assemblies.
Why Choose 5SGSED6K3F40C2LG?
The 5SGSED6K3F40C2LG positions itself as a high-capacity Stratix V GS FPGA option for designers who need extensive logic resources, significant on-chip memory, and a high I/O count in a compact BGA package. Its voltage supply window and commercial temperature rating make it suitable for mainstream performance-focused applications that require scalable, integrated programmable logic.
For engineering teams building complex digital systems—where consolidation of functions, on-chip buffering, and broad external connectivity are priorities—this device offers a clear specification set that supports robust system-level design decisions while remaining compliant with RoHS requirements.
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