5SGSED6K3F40C2N

The 5SGSED6K3F40C2N is a Stratix® V GS field-programmable gate array (FPGA) in a 1517-BBGA (40×40) FCBGA surface-mount package. It combines high logic density, abundant embedded memory, and a rich set of DSP and I/O resources to address transceiver-based, DSP-centric and bandwidth-intensive designs.

Built on the Stratix V architecture, this device targets applications that require large logic capacity, substantial on-chip RAM, and integrated high-speed transceivers, while operating from a low-voltage core supply and a commercial temperature range.

Key Features

• Core and Process 28‑nm Stratix V architecture with a redesigned adaptive logic module (ALM) for high-performance logic implementation; device core supply specified at 870 mV to 930 mV.
• Logic Capacity 583,000 logic elements to support large, complex designs and system-level integration.
• Embedded Memory Approximately 46 Mbits of on-chip RAM delivered through M20K memory blocks for buffering, packet handling, and intermediate DSP storage.
• Variable-Precision DSP Stratix V GS family provides variable-precision DSP blocks and supports up to 3,926 18×18 or 1,963 27×27 multipliers for intensive signal-processing tasks.
• I/O and Transceivers 696 device I/O pins and integrated transceivers (Stratix V GS class) with 14.1‑Gbps data-rate capability for high-bandwidth serial links and backplane or optical interfaces.
• Power and Compliance Low-voltage core operation (870 mV–930 mV) and RoHS-compliant construction for regulatory alignment.
• Package and Thermal 1517‑BBGA (FCBGA, 40×40) surface-mount package; commercial operating temperature range 0 °C to 85 °C.

Typical Applications

• Optical and Backplane Communications High-speed transceivers and extensive I/O are suited to 40G/100G transport and other bandwidth-centric optical or backplane interfaces.
• Data-Intensive Networking Large logic capacity and embedded memory enable packet processing, traffic management, and PCIe Gen3 protocol implementations.
• High-Performance DSP Variable-precision DSP blocks and numerous multipliers support broadcast, wireline, and high-performance compute signal-processing chains.
• Military and Test Equipment The combination of DSP resources, transceiver capability, and high I/O count supports demanding test, instrumentation, and communication systems.

Unique Advantages

• High Logic Integration: 583,000 logic elements allow substantial system integration on a single device, reducing external FPGA count and board complexity.
• Significant On-Chip RAM: Approximately 46 Mbits of embedded memory provide large buffers and fast local storage for data-intensive processing.
• DSP-Centric Capability: Variable-precision DSP blocks and thousands of multipliers accelerate high-throughput signal-processing functions.
• High-Speed Serial Connectivity: Integrated transceivers with 14.1‑Gbps capability enable high-bandwidth serial links for optical, backplane, and networking interfaces.
• Extensive I/O: 696 I/O pins support complex interfaces and multiple parallel buses without external expansion.
• Production-Ready Package: 1517‑BBGA FCBGA surface-mount package facilitates board-level assembly and high-volume manufacturing.

Why Choose 5SGSED6K3F40C2N?

The 5SGSED6K3F40C2N positions itself as a high-capacity Stratix V GS FPGA for designs that combine heavy DSP workloads, large logic integration, and high-bandwidth serial connectivity. Its mix of logic elements, embedded memory, DSP multipliers, and transceivers makes it suitable for systems that consolidate multiple functions onto a single device.

For teams designing network, communications, broadcast, test, or compute-focused equipment, this device offers a scalable platform with a commercial operating range, low-voltage core operation, and RoHS compliance—helping simplify BOMs and support production deployment.

If you would like pricing, availability, or a formal quote for 5SGSED6K3F40C2N, please request a quote or submit an inquiry to our sales team with your requirements.