5SGSED6K3F40C3G

The 5SGSED6K3F40C3G is a Stratix® V GS family FPGA IC in a 1517-BBGA (1517-FBGA, 40×40) package, offered as a commercial-grade, surface-mount device. It provides a high density of programmable logic and on-chip memory with a broad I/O complement for complex digital designs.

Designed for applications that require large logic capacity and substantial embedded RAM, this device operates from a core supply range of 820 mV to 880 mV and supports an ambient operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• High logic capacity — 583,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM for buffering, data storage, and intermediate processing without external memory.
• Extensive I/O — 696 user I/O pins to support wide parallel interfaces and system-level connectivity.
• Power and core supply — Core voltage supply range from 820 mV to 880 mV to match system power-rail designs and enable predictable core operation.
• Package and mounting — 1517-BBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount package suitable for standard PCB assembly.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for typical commercial environments.
• Standards compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density digital systems — Systems that require large logic capacity and numerous I/O lines can utilize the 583,000 logic elements and 696 I/Os for complex signal routing and control.
• On-chip buffering and storage — Designs needing substantial embedded memory can take advantage of approximately 46.08 Mbits of RAM for data buffering and temporary storage.
• Board-level integration — The 1517-FBGA (40×40) package and surface-mount form factor support compact PCB implementations where board-area and I/O count are critical.

Unique Advantages

• Large programmable fabric: 583,000 logic elements provide the headroom to implement complex algorithms and dense logic without immediate partitioning across multiple devices.
• Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and lowering BOM complexity.
• High I/O count: 696 I/Os enable broad interfacing options for parallel buses, multiple peripheral connections, and dense signal routing.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.
• RoHS compliant: Meets common environmental and manufacturing compliance expectations for modern electronics production.
• Standard BGA footprint: The 1517-FBGA (40×40) package accommodates existing PCB assembly processes and industry-standard BGA handling.

Why Choose 5SGSED6K3F40C3G?

The 5SGSED6K3F40C3G positions itself as a high-density Stratix V GS FPGA that combines substantial logic capacity with large on-chip RAM and extensive I/O in a compact 1517-FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic products where integration density and memory capacity are priorities.

Engineering teams targeting complex digital designs that require sizable programmable resources, broad interfacing capability, and a predictable core voltage range will find this device a practical choice. The datasheet provides detailed electrical and switching characteristics for system-level integration and reliability planning.

Request a quote or submit a pricing and availability inquiry to obtain ordering information and lead-time details for the 5SGSED6K3F40C3G.