5SGSED6K3F40C3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 118 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6K3F40C3N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 I/O, ~46 Mbits RAM, 583000 logic elements, 1517-BBGA

The 5SGSED6K3F40C3N is an Intel Stratix V GS FPGA configured for DSP-centric, transceiver-enabled designs. Built on the Stratix V family architecture, it delivers a combination of large logic capacity, substantial on-chip memory, and integrated transceiver and DSP resources suited for bandwidth- and compute-intensive applications.

This device provides approximately 583,000 logic elements, about 46 Mbits of embedded memory, and 696 I/O pins in a 1517-BBGA FCBGA package, making it appropriate for high-density signal processing, networking, and communications systems operating within commercial temperature and voltage ranges.

Key Features

  • Logic Capacity Approximately 583,000 logic elements for complex FPGA designs and high gate-count implementations.
  • Embedded Memory Approximately 46 Mbits of on-chip RAM (total RAM bits: 46,080,000) to support large buffering, packet processing, and on-chip data storage.
  • DSP Resources Stratix V GS family devices include abundant variable-precision DSP blocks; the family supports high-density multiplier configurations suitable for high-performance signal processing workloads.
  • Integrated Transceivers GS-series devices provide integrated transceivers with multi-gigabit data-rate capability for backplane, optical, and high-speed serial interfaces.
  • I/O and Packaging 696 I/O pins in a 1517-BBGA (supplier device package: 1517-FBGA, 40×40) surface-mount package, enabling dense board connectivity and flexible I/O mapping.
  • Power and Temperature Core supply range specified at 820 mV to 880 mV with commercial-grade operating temperature from 0 °C to 85 °C, matching typical commercial system requirements.
  • Fabric and Clocking Stratix V devices use an enhanced core architecture with multi-track routing and comprehensive fabric clocking, plus fractional PLLs for flexible clock management and timing control.
  • Design Integration The family includes embedded hard IP blocks such as the Embedded HardCopy Block for hardened PCIe instantiation and other system-level IP integration.
  • RoHS Compliant Device is RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • High-performance Digital Signal Processing Use the device’s dense DSP resources and large on-chip memory for waveform processing, FFTs, and algorithmic acceleration in broadcast and compute systems.
  • Network and Optical Transport Integrated transceivers and abundant logic make this FPGA suitable for packet processing, backplane interfaces, and 40G/100G optical transport system elements.
  • Military and Broadcast Systems The combination of DSP capability and multi-gigabit transceivers supports real-time signal handling and high-throughput streaming in communications and broadcast equipment.
  • High-performance Computing (HPC) Acceleration Large logic and memory resources enable implementation of custom acceleration kernels and data-path engines for compute-intensive workloads.

Unique Advantages

  • High Logic Density: Approximately 583,000 logic elements allow integration of complex state machines, protocol stacks, and datapath logic on a single device, reducing board-level component count.
  • Substantial On-chip Memory: About 46 Mbits of embedded RAM supports large buffers and reduces external memory dependence for many real-time and packet-processing applications.
  • Extensive I/O Availability: 696 I/O pins in a 1517-BBGA package provide flexible I/O mapping for multi-channel systems and dense peripheral connectivity.
  • Transceiver and DSP Integration: On-die transceivers and variable-precision DSP blocks simplify high-bandwidth and signal-processing designs by consolidating critical functions into the FPGA fabric.
  • Commercial-grade Compatibility: Specified for 0 °C to 85 °C operation and RoHS compliance to meet common commercial manufacturing and deployment requirements.
  • Power-optimized Core Range: Core voltage range of 820 mV to 880 mV enables designs that target low-voltage FPGA cores consistent with family-level power architectures.

Why Choose 5SGSED6K3F40C3N?

The 5SGSED6K3F40C3N offers a balanced combination of large logic capacity, significant embedded memory, rich DSP resources, and integrated transceiver capability in a compact 1517-BBGA package. Its Stratix V GS-class architecture targets transceiver-based, DSP-heavy applications where on-chip compute and high-speed I/O are central to system performance.

This device is well suited for engineering teams building high-throughput networking, communications, broadcast, and compute-acceleration solutions that require integrated DSP and serial interfaces while operating within commercial voltage and temperature ranges. The Stratix V family architecture and embedded hard IP also support design reuse and migration paths for production scaling.

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