5SGSED6K2F40I3LNCV

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,083 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6K2F40I3LNCV – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 583,000 logic elements, 696 I/Os

The 5SGSED6K2F40I3LNCV is a Stratix® V GS family Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade applications. It combines large logic capacity, substantial embedded memory, and a high I/O count in a 1517-BBGA FCBGA package to support complex digital designs and system integration.

Targeted at applications that require significant on-chip resources and robust thermal tolerance, this device offers a combination of performance-oriented architecture and system-level I/O density to accelerate custom logic, signal processing, and high-channel-count interfacing.

Key Features

  • Core density  Approximately 583,000 logic elements, providing extensive programmable logic for complex designs.
  • Logic array resources  220,000 CLBs to structure and organize large-scale logic implementations.
  • Embedded memory  Approximately 46.08 Mbits of total on-chip RAM (46,080,000 total RAM bits) for buffering, FIFOs, and embedded data storage.
  • I/O capacity  696 user I/Os to support high-channel-count external interfaces and parallel connectivity.
  • Package and mounting  1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount package suitable for dense board designs.
  • Power  Core voltage supply range from 820 mV to 880 mV for device operation.
  • Industrial operating range  Designed and graded for industrial use with an operating temperature range of −40°C to 100°C.
  • Compliance  RoHS compliant for regulated material requirements.
  • Series-level transceiver options  Stratix V GS family devices are offered with transceiver speed grades as part of the Stratix V series specification set (refer to series documentation for detailed transceiver options and speed-grade selection).

Typical Applications

  • High-density compute acceleration  On-board hardware acceleration and custom datapath implementations that require large logic and memory resources to offload CPU workloads.
  • Network and packet processing  High I/O count and abundant logic enable complex packet parsing, switching, and protocol handling in networking equipment and appliances.
  • Signal processing and instrumentation  Embedded memory and logic density support DSP pipelines, buffering, and real-time processing for test, measurement, and communication systems.
  • Prototyping and system integration  A platform for validating large-scale system logic, integrating multiple interfaces, and consolidating discrete functions into a single programmable device.

Unique Advantages

  • High on-chip resource count: 583,000 logic elements and 46.08 Mbits of embedded RAM enable implementation of large, complex designs without immediate external memory dependence.
  • Extensive I/O scalability: 696 user I/Os allow for wide parallel interfaces, multi-channel sensor or actuator connectivity, and dense board-level integration.
  • Industrial temperature rating: Operation from −40°C to 100°C supports deployment in demanding environmental conditions where broader temperature tolerance is required.
  • Compact, manufacturable package: 1517-BBGA (FCBGA) surface-mount package balances high pin count with board-level density for modern PCB designs.
  • Controlled core voltage: 820–880 mV supply specification provides a defined power envelope for system power budgeting and thermal design.
  • RoHS compliance: Meets regulated material requirements for many commercial and industrial supply chains.

Why Choose 5SGSED6K2F40I3LNCV?

The 5SGSED6K2F40I3LNCV positions itself as a high-capacity Stratix V GS FPGA option for engineers who need significant programmable logic, abundant embedded memory, and a large complement of I/Os in an industrial-grade package. Its specification set supports complex algorithm implementation, extensive interfacing, and robust operation across a wide temperature range.

Design teams targeting scalable, high-density FPGA solutions will find this device suited for applications where consolidation of multiple functions into a single programmable device reduces board complexity and supports long-term design flexibility within the Stratix V ecosystem.

Request a quote or submit an inquiry to start the procurement process for the 5SGSED6K2F40I3LNCV and evaluate how this Stratix V GS FPGA can meet your project requirements.

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