5SGSED6K2F40I3LNCV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,083 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K2F40I3LNCV – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 583,000 logic elements, 696 I/Os
The 5SGSED6K2F40I3LNCV is a Stratix® V GS family Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade applications. It combines large logic capacity, substantial embedded memory, and a high I/O count in a 1517-BBGA FCBGA package to support complex digital designs and system integration.
Targeted at applications that require significant on-chip resources and robust thermal tolerance, this device offers a combination of performance-oriented architecture and system-level I/O density to accelerate custom logic, signal processing, and high-channel-count interfacing.
Key Features
- Core density Approximately 583,000 logic elements, providing extensive programmable logic for complex designs.
- Logic array resources 220,000 CLBs to structure and organize large-scale logic implementations.
- Embedded memory Approximately 46.08 Mbits of total on-chip RAM (46,080,000 total RAM bits) for buffering, FIFOs, and embedded data storage.
- I/O capacity 696 user I/Os to support high-channel-count external interfaces and parallel connectivity.
- Package and mounting 1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40); surface-mount package suitable for dense board designs.
- Power Core voltage supply range from 820 mV to 880 mV for device operation.
- Industrial operating range Designed and graded for industrial use with an operating temperature range of −40°C to 100°C.
- Compliance RoHS compliant for regulated material requirements.
- Series-level transceiver options Stratix V GS family devices are offered with transceiver speed grades as part of the Stratix V series specification set (refer to series documentation for detailed transceiver options and speed-grade selection).
Typical Applications
- High-density compute acceleration On-board hardware acceleration and custom datapath implementations that require large logic and memory resources to offload CPU workloads.
- Network and packet processing High I/O count and abundant logic enable complex packet parsing, switching, and protocol handling in networking equipment and appliances.
- Signal processing and instrumentation Embedded memory and logic density support DSP pipelines, buffering, and real-time processing for test, measurement, and communication systems.
- Prototyping and system integration A platform for validating large-scale system logic, integrating multiple interfaces, and consolidating discrete functions into a single programmable device.
Unique Advantages
- High on-chip resource count: 583,000 logic elements and 46.08 Mbits of embedded RAM enable implementation of large, complex designs without immediate external memory dependence.
- Extensive I/O scalability: 696 user I/Os allow for wide parallel interfaces, multi-channel sensor or actuator connectivity, and dense board-level integration.
- Industrial temperature rating: Operation from −40°C to 100°C supports deployment in demanding environmental conditions where broader temperature tolerance is required.
- Compact, manufacturable package: 1517-BBGA (FCBGA) surface-mount package balances high pin count with board-level density for modern PCB designs.
- Controlled core voltage: 820–880 mV supply specification provides a defined power envelope for system power budgeting and thermal design.
- RoHS compliance: Meets regulated material requirements for many commercial and industrial supply chains.
Why Choose 5SGSED6K2F40I3LNCV?
The 5SGSED6K2F40I3LNCV positions itself as a high-capacity Stratix V GS FPGA option for engineers who need significant programmable logic, abundant embedded memory, and a large complement of I/Os in an industrial-grade package. Its specification set supports complex algorithm implementation, extensive interfacing, and robust operation across a wide temperature range.
Design teams targeting scalable, high-density FPGA solutions will find this device suited for applications where consolidation of multiple functions into a single programmable device reduces board complexity and supports long-term design flexibility within the Stratix V ecosystem.
Request a quote or submit an inquiry to start the procurement process for the 5SGSED6K2F40I3LNCV and evaluate how this Stratix V GS FPGA can meet your project requirements.

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