5SGSED6K2F40I3N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 699 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K2F40I3N – Stratix V GS Field Programmable Gate Array (FPGA) IC
The 5SGSED6K2F40I3N is an Intel Stratix® V GS series Field Programmable Gate Array supplied in a 1517-BBGA FCBGA package. This industrial-grade FPGA provides extensive programmable logic and on-chip memory, together with a high I/O count and defined core voltage range for integration into demanding embedded designs.
With 583,000 logic elements, approximately 46.08 Mbits of embedded memory, and 696 general-purpose I/O pins, this device is suited for large, logic- and memory-intensive digital systems that require robust temperature and power operating windows.
Key Features
- Core Logic 583,000 logic elements to implement complex digital functions and parallel processing engines.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support large buffers, frame storage, and embedded data structures.
- I/O Density 696 I/O pins for extensive external connectivity and high channel-count interfaces.
- Power and Voltage Specified core voltage supply range of 820 mV to 880 mV to match system power architectures.
- Package & Mounting 1517-BBGA (supplier package: 1517-FBGA 40×40) in an FCBGA form factor, optimized for surface-mount assembly.
- Temperature & Grade Industrial temperature rating with an operating range from −40°C to 100°C for deployment in temperature-variable environments.
- RoHS Compliant Meets RoHS requirements for regulatory environmental compliance.
Typical Applications
- High-density digital processing — Implement complex state machines, custom accelerators, and signal-processing pipelines using abundant logic elements and embedded RAM.
- Multi-channel I/O systems — Support high-channel-count interfaces and dense peripheral connectivity with 696 available I/Os.
- Industrial control and automation — Leverage industrial temperature rating and surface-mount packaging for dependable operation in factory and industrial environments.
- Embedded memory–intensive designs — Use approximately 46.08 Mbits of on-chip RAM for buffering, queuing, and local data storage to minimize external memory dependence.
Unique Advantages
- Extensive programmable resources: 583,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing overall system BOM.
- Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM enables large local datasets and temporary storage without relying solely on external memory.
- High I/O count: 696 I/Os simplify routing of multiple interfaces and sensors, reducing the need for external multiplexing components.
- Industrial temperature range: Rated from −40°C to 100°C to maintain operation across a broad set of environmental conditions.
- Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) surface-mount packaging supports high-density board layouts and modern assembly processes.
- Controlled core voltage: Defined 820 mV–880 mV supply window supports predictable power budgeting and integration into regulated power systems.
Why Choose 5SGSED6K2F40I3N?
The 5SGSED6K2F40I3N delivers a combination of large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade FCBGA package. These characteristics make it well-suited for engineers developing large, memory- and I/O-intensive digital systems that require reliable operation across a wide temperature range.
Selecting this Stratix V GS device enables consolidation of complex functions onto a single FPGA footprint, offering designers a scalable platform for high-density workloads while simplifying board-level integration through a defined voltage range and surface-mount packaging.
Request a quote or submit an inquiry for the 5SGSED6K2F40I3N to get pricing and availability information for your next design.

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