5SGSED6K2F40I3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 699 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6K2F40I3N – Stratix V GS Field Programmable Gate Array (FPGA) IC

The 5SGSED6K2F40I3N is an Intel Stratix® V GS series Field Programmable Gate Array supplied in a 1517-BBGA FCBGA package. This industrial-grade FPGA provides extensive programmable logic and on-chip memory, together with a high I/O count and defined core voltage range for integration into demanding embedded designs.

With 583,000 logic elements, approximately 46.08 Mbits of embedded memory, and 696 general-purpose I/O pins, this device is suited for large, logic- and memory-intensive digital systems that require robust temperature and power operating windows.

Key Features

  • Core Logic 583,000 logic elements to implement complex digital functions and parallel processing engines.
  • Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support large buffers, frame storage, and embedded data structures.
  • I/O Density 696 I/O pins for extensive external connectivity and high channel-count interfaces.
  • Power and Voltage Specified core voltage supply range of 820 mV to 880 mV to match system power architectures.
  • Package & Mounting 1517-BBGA (supplier package: 1517-FBGA 40×40) in an FCBGA form factor, optimized for surface-mount assembly.
  • Temperature & Grade Industrial temperature rating with an operating range from −40°C to 100°C for deployment in temperature-variable environments.
  • RoHS Compliant Meets RoHS requirements for regulatory environmental compliance.

Typical Applications

  • High-density digital processing — Implement complex state machines, custom accelerators, and signal-processing pipelines using abundant logic elements and embedded RAM.
  • Multi-channel I/O systems — Support high-channel-count interfaces and dense peripheral connectivity with 696 available I/Os.
  • Industrial control and automation — Leverage industrial temperature rating and surface-mount packaging for dependable operation in factory and industrial environments.
  • Embedded memory–intensive designs — Use approximately 46.08 Mbits of on-chip RAM for buffering, queuing, and local data storage to minimize external memory dependence.

Unique Advantages

  • Extensive programmable resources: 583,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing overall system BOM.
  • Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM enables large local datasets and temporary storage without relying solely on external memory.
  • High I/O count: 696 I/Os simplify routing of multiple interfaces and sensors, reducing the need for external multiplexing components.
  • Industrial temperature range: Rated from −40°C to 100°C to maintain operation across a broad set of environmental conditions.
  • Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) surface-mount packaging supports high-density board layouts and modern assembly processes.
  • Controlled core voltage: Defined 820 mV–880 mV supply window supports predictable power budgeting and integration into regulated power systems.

Why Choose 5SGSED6K2F40I3N?

The 5SGSED6K2F40I3N delivers a combination of large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade FCBGA package. These characteristics make it well-suited for engineers developing large, memory- and I/O-intensive digital systems that require reliable operation across a wide temperature range.

Selecting this Stratix V GS device enables consolidation of complex functions onto a single FPGA footprint, offering designers a scalable platform for high-density workloads while simplifying board-level integration through a defined voltage range and surface-mount packaging.

Request a quote or submit an inquiry for the 5SGSED6K2F40I3N to get pricing and availability information for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up