5SGSMD5H3F35I3LN

The 5SGSMD5H3F35I3LN is a Stratix V GS FPGA IC in a 1152‑BBGA (FCBGA) package, offered as an industrial‑grade programmable logic device. It delivers substantial logic and embedded memory capacity alongside a high I/O count, and is specified for extended temperature and low‑voltage core operation.

Key Features

• Logic Capacity  Approximately 457,000 logic elements to support large, complex programmable logic designs.
• Configurable Logic Blocks (CLBs)  Approximately 172,600 LABs/CLBs for structured resource partitioning and mapping.
• Embedded Memory  Approximately 39.9 Mbits of embedded RAM for on‑chip storage and buffering.
• I/O Count  552 user I/Os providing broad connectivity to external devices and systems.
• Power and Core Supply  Core supply specified at 820 mV to 880 mV for low‑voltage operation.
• Package & Mounting  1152‑BBGA, FCBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor suitable for compact boards.
• Temperature Range  Industrial operating range of −40 °C to 100 °C for deployment in extended‑temperature environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic implementations  Leveraging the device’s large logic element count and LAB resources for complex, custom logic.
• On‑chip buffering and data staging  Using the approximately 39.9 Mbits of embedded RAM for intermediate storage and streaming tasks.
• High‑pin‑count system interfaces  Taking advantage of 552 I/Os for broad peripheral and bus connectivity in embedded systems.
• Industrial embedded systems  Deployment in systems that require extended temperature operation and surface‑mount packaging.

Unique Advantages

• Substantial logic resources: Approximately 457,000 logic elements enable large‑scale, highly parallel logic implementations without immediate need for multi‑device partitioning.
• Significant on‑chip memory: Approximately 39.9 Mbits of embedded RAM reduces external memory dependence and simplifies board design for many buffering tasks.
• High I/O density: 552 I/Os provide flexibility for multi‑interface designs and high‑channel count systems.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports reliability in extended‑temperature environments.
• Compact BGA package: 1152‑BBGA (35×35) surface‑mount package delivers a compact footprint for space‑constrained PCBs.
• Low core voltage operation: Core supply range of 820–880 mV supports low‑voltage system architectures.

Why Choose 5SGSMD5H3F35I3LN?

This Stratix V GS FPGA balances high logic and memory capacity with a large I/O complement and industrial temperature qualification, making it suitable for complex, high‑density programmable designs that need robust on‑chip resources. The combination of approximately 457,000 logic elements, roughly 39.9 Mbits of embedded RAM, and 552 I/Os in a 1152‑BBGA surface‑mount package provides a compact, high‑capacity platform for demanding embedded applications.

Designed as part of the Stratix V family, the 5SGSMD5H3F35I3LN offers specification‑level detail for engineering and procurement teams evaluating scalable, long‑lifecycle FPGA resources for industrial deployments.

Request a quote or submit an inquiry today to discuss availability and delivery for the 5SGSMD5H3F35I3LN Stratix V GS FPGA.