5SGSMD5H3F35I3LNAA

The 5SGSMD5H3F35I3LNAA is a Stratix® V GS field programmable gate array (FPGA) from Intel, supplied in a 1152-BBGA FCBGA package. This industrial-grade device provides a large programmable fabric and on-chip memory for complex digital designs requiring substantial logic capacity and I/O connectivity.

Designed for applications that require high logic density and extensive I/O, the device combines a wide operating temperature range and low core-voltage operation to support demanding system-level requirements.

Key Features

• Logic Capacity  457,000 logic elements to implement large-scale digital functions and complex architectures.
• Embedded Memory  Approximately 39.9 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures.
• I/O Density  552 user I/O pins to support broad interfacing options with external devices and subsystems.
• Power and Core Supply  Core voltage operation between 820 mV and 880 mV to match system power-rail constraints.
• Package and Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance  RoHS-compliant material and manufacturing status.
• Family Notes (from datasheet)  Stratix V GS devices are part of the Stratix V family and are offered in multiple transceiver speed grades as documented in the device datasheet.

Unique Advantages

• High logic integration: 457,000 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 39.9 Mbits of embedded RAM supports large buffering and local data storage without external memory dependence.
• Extensive I/O for system connectivity: 552 I/O pins provide flexibility for interfacing with high-pin-count peripherals and multi-channel designs.
• Industrial robustness: −40 °C to 100 °C operating range aligns with demanding industrial deployment requirements.
• Compact, manufacturable package: 1152-BBGA (35×35) FCBGA in a surface-mount format simplifies high-density board layouts while supporting automated assembly.
• Low-voltage core operation: 820–880 mV core supply minimizes core power rails and aligns with modern power architectures.

Why Choose 5SGSMD5H3F35I3LNAA?

The 5SGSMD5H3F35I3LNAA offers a balance of very large logic capacity, substantial embedded memory, and plentiful I/O in an industrial-grade Stratix V GS FPGA package. Its combination of specs makes it suitable for designs that require consolidating high-density logic, significant on-chip RAM, and many external interfaces within a compact surface-mount package.

Engineers and procurement teams seeking a scalable, robust FPGA platform will find this device appropriate for complex digital processing tasks and industrial environments where temperature range, RoHS compliance, and board-level integration are key considerations.

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