5SGSMD5H3F35I3N

The 5SGSMD5H3F35I3N is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers high logic capacity, substantial embedded memory, and extensive I/O in a 1152-ball BGA footprint for surface-mount designs.

Designed for applications that require large programmable fabric and robust I/O count, this device combines 457,000 logic elements with approximately 39.9 Mbits of on-chip RAM and 552 general-purpose I/Os, and operates over an industrial temperature range with a tightly specified core supply voltage.

Key Features

• Logic Capacity  457,000 logic elements provide significant programmable fabric for complex custom logic and acceleration tasks.
• Embedded Memory  Approximately 39.9 Mbits of on-chip RAM to support large buffering, state storage, and memory-mapped logic functions.
• I/O Resources  552 I/O pins to support dense external connectivity and interfacing with multiple peripherals or high-channel-count systems.
• Package  1152-BBGA (FCBGA) supplier package; supplier device package listed as 1152-FBGA (35×35) for compact, high-density board integration.
• Power Supply  Core supply voltage specified between 820 mV and 880 mV, enabling precise power budgeting and regulator selection.
• Thermal/Environmental  Industrial temperature grade with an operating range of −40 °C to 100 °C suitable for extended-temperature applications.
• Mounting  Surface-mount package for automated PCB assembly and reliable mechanical connection.
• Compliance  RoHS compliant, supporting regulatory and environmental requirements for many industrial designs.

Typical Applications

• High-density logic and glue logic  Large logic element count supports complex custom logic implementations, protocol bridging, and system glue functions where integration density matters.
• Memory-intensive designs  Approximately 39.9 Mbits of embedded memory enables on-chip buffering, packet staging, and state storage without immediate dependence on external RAM.
• Multi-channel I/O systems  With 552 I/Os, the device is suitable for applications requiring many parallel interfaces, sensor arrays, or multi-lane connectivity.
• Industrial controls and instrumentation  Industrial temperature rating and surface-mount BGA packaging make the device appropriate for deployed equipment operating across wide temperature ranges.

Unique Advantages

• High fabric density: 457,000 logic elements provide the headroom to consolidate multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 39.9 Mbits of embedded RAM helps minimize external memory requirements and improves system-level latency.
• Extensive I/O: 552 I/Os simplify integration with large peripheral counts and multi-lane interfaces, reducing the need for external I/O expanders.
• Industrial temperature support: Specified operation from −40 °C to 100 °C for reliable deployment in temperature-challenging environments.
• Compact, high-density package: 1152-ball BGA (35×35) enables space-efficient PCB layouts while maintaining a high pin count.
• RoHS compliance: Meets common environmental compliance requirements for commercial and industrial products.

Why Choose 5SGSMD5H3F35I3N?

The 5SGSMD5H3F35I3N positions itself as a high-capacity, industrial-grade Stratix V GS FPGA suitable for designs that demand large programmable logic, significant on-chip memory, and a high I/O count within a compact BGA package. Its specified core voltage range and extended operating temperature make it a predictable choice for systems requiring strict power and thermal considerations.

This device is a fit for engineering teams looking to consolidate complex functions into a single programmable device while maintaining the documentation and electrical characterization provided in the Stratix V device datasheet for design and qualification purposes.

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