5SGSMD5H3F35I3WN

The 5SGSMD5H3F35I3WN is an Intel Stratix® V GS field programmable gate array in an industrial-grade FCBGA package. It delivers a high-density programmable fabric with 457,000 logic elements and approximately 39.94 Mbits of on-chip RAM, combined with a wide I/O count for complex system integration.

Engineered for demanding embedded and industrial applications, this device provides a balance of integration, configurable logic resources, and on-chip memory while operating over a wide temperature and low-voltage core range.

Key Features

• High-density logic  457,000 logic elements for implementing complex digital designs and large-scale programmable logic functions.
• Embedded memory  Approximately 39.94 Mbits of total on-chip RAM to support buffering, state machines, and data-intensive operations.
• High I/O count  552 user I/O pins to support extensive peripheral connectivity and multi-channel interfaces.
• Packaging  1152-BBGA FCBGA (supplier package: 1152-FBGA (35×35)) surface-mount package for dense board-level integration.
• Industrial temperature grade  Rated for operation from –40 °C to 100 °C to meet industrial-environment requirements.
• Low-voltage core  Core voltage supply range from 820 mV to 880 mV to support low-power system architectures.
• Standards and compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-performance embedded systems  Use the device’s large logic capacity and on-chip RAM for real-time processing, protocol handling, and custom accelerators.
• Telecommunications and networking  Leverage the high I/O count and dense logic fabric for packet processing, interface bridging, and custom network functions.
• Industrial control and automation  Industrial temperature rating and robust integration make it suitable for motor control, PLC offloads, and factory automation logic.
• Data acquisition and signal processing  On-chip memory and logic resources support buffering, filtering, and deterministic processing pipelines.

Unique Advantages

• Large programmable fabric: 457,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 39.94 Mbits of embedded RAM minimizes external memory dependence for latency-sensitive designs.
• Extensive I/O flexibility: 552 I/Os allow designers to support numerous interfaces and peripherals without multiplexing compromises.
• Industry-grade reliability: Rated –40 °C to 100 °C for reliable operation in industrial environments.
• Compact, manufacturable package: 1152-BBGA FCBGA surface-mount package supports high-density PCB layouts and automated assembly workflows.
• Regulatory compliance: RoHS compliance simplifies environmental and compliance planning.

Why Choose 5SGSMD5H3F35I3WN?

The 5SGSMD5H3F35I3WN combines a high-density Stratix V GS architecture with extensive on-chip RAM and a large I/O count to address complex, resource-intensive designs in industrial and embedded markets. Its industrial temperature rating and low-voltage core operation make it suitable for deployments that require both robustness and power-conscious design choices.

For engineering teams designing advanced signal processing, networking, or control systems, this FPGA provides the integration and scalability to consolidate multiple functions, reduce BOM complexity, and accelerate time-to-market while maintaining verifiable electrical and packaging specifications.

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