5SGSMD5H3F35I4WN

The 5SGSMD5H3F35I4WN is an industrial‑grade Stratix® V GS Field Programmable Gate Array (FPGA) IC supplied in a 1152‑ball BGA package. It provides high logic density, substantial on‑chip memory, and a large I/O count for complex, high‑integration digital designs.

Designed for applications that require large programmable logic capacity and extensive I/O, this device delivers a combination of core resources, embedded memory, and industry‑grade operating range suitable for demanding environments.

Key Features

• Logic Capacity  Approximately 457,000 logic elements for implementing large, complex designs and custom hardware acceleration.
• Embedded Memory  Approximately 39.94 Mbits of embedded memory to support buffering, on‑chip data storage, and state machines.
• I/O  552 dedicated I/O pins to support wide external interfacing and high channel counts.
• Power Supply  Core/primary voltage supply range of 820 mV to 880 mV, enabling designs constrained to tight core‑voltage requirements.
• Package & Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount device for standard PCB assembly.
• Operating Range & Grade  Industrial temperature grade with an operating range of −40°C to 100°C for deployment in temperature‑challenging environments.
• On‑chip Fabric Resources  Approximately 172,600 LABs/CLBs equivalent fabric resources for structured logic and routing (reported as 172,600 Labs/CLBs).
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• High‑density logic designs  Systems that need large programmable fabric and embedded memory can leverage the device’s ~457k logic elements and ~39.94 Mbits of RAM for complex datapath and control logic.
• Multi‑channel I/O systems  Designs requiring extensive external interfacing benefit from the device’s 552 I/O pins for parallel sensors, I/O expansion, or multiport connectivity.
• Industrial controllers and equipment  The industrial operating grade (−40°C to 100°C) makes this FPGA suitable for industrial automation and control applications that require robust temperature tolerance.
• On‑chip buffering and state handling  Approximately 39.94 Mbits of embedded memory supports buffering, FIFOs, and local data storage for streaming and packet processing tasks.

Unique Advantages

• Substantial logic resources: With approximately 457,000 logic elements, the device enables integration of large functions and multiple subsystems on a single FPGA, reducing external component count.
• Large embedded memory: Approximately 39.94 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and temporary storage needs.
• High I/O density: 552 I/Os provide flexibility to connect many peripherals, interfaces, and parallel data streams without multiplexing compromises.
• Industrial operating range: Rated for −40°C to 100°C operation, allowing deployment in thermally demanding industrial environments.
• Compact BGA packaging: 1152‑BBGA / 1152‑FBGA (35×35) delivers high pin count in a compact surface‑mount form factor suitable for dense PCB layouts.
• Standards‑aligned environmental compliance: RoHS compliance supports lead‑free assembly and environmental requirements.

Why Choose 5SGSMD5H3F35I4WN?

The 5SGSMD5H3F35I4WN combines high logic density, extensive embedded memory, and a large I/O complement in an industrial‑grade Stratix V GS FPGA package. Its specified voltage range, package options, and thermal rating make it appropriate for engineers targeting highly integrated, temperature‑tolerant digital systems that consolidate functionality on a single device.

Engineers and procurement teams can select this part when they need substantial on‑chip resources, robust I/O capacity, and the predictability of Stratix V family documentation and specifications to support design and validation cycles.

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