5SGSMD5H3F35M4

The 5SGSMD5H3F35M4 is a Stratix® V GS field-programmable gate array (FPGA) supplied in a 1152-BBGA, FCBGA package. It delivers high logic capacity and substantial on‑chip RAM for complex programmable logic designs while offering a military grade operating range.

Targeted at designs that require large logic arrays, abundant embedded memory, and extensive I/O, this device supports applications that demand robustness across a wide temperature range and a compact surface-mount ball-grid array package.

Key Features

• Logic Capacity  690,400 logic elements providing significant programmable logic resources for large-scale designs.
• Embedded Memory  Approximately 46.8 Mbits of on-chip RAM to support buffering, DSP functions, and state storage without external memory.
• I/O Resources  552 user I/O pins to support complex interfacing requirements and multiple parallel interfaces.
• Power and Core Voltage  Core supply specified at 820 mV to 930 mV for the device power domain.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA (35x35)), delivered in a surface-mount form factor for high-density PCBs.
• Temperature and Grade  Military grade with an operating temperature range of -40°C to 125°C for deployment in harsh environments.
• Documentation and Family Characteristics  Device electrical and switching characteristics, including core and periphery performance and transceiver information for the Stratix V family, are documented in the manufacturer datasheet for deeper design guidance.
• Compliance  RoHS compliant.

Typical Applications

• Defense and Aerospace Electronics  Military-grade temperature range and high logic density make this FPGA suitable for rugged embedded signal processing and control systems.
• High-Density Logic and Prototyping  Large number of logic elements and substantial on-chip RAM support complex algorithm implementation and hardware prototyping.
• Communications and Networking Equipment  High I/O count and the Stratix V family electrical/switching documentation support integration into advanced network and telecom designs.

Unique Advantages

• High Logic Density: 690,400 logic elements provide the capacity to implement large, integrated systems on a single FPGA, reducing external logic count.
• Large On-Chip Memory: Approximately 46.8 Mbits of embedded RAM reduces dependence on external memory for buffering and data-path operations.
• Extensive I/O: 552 I/O pins allow flexible interfacing and support for multiple parallel buses or high-channel-count designs.
• Mil-Spec Thermal Range: Rated from -40°C to 125°C to meet demanding environmental requirements for deployed systems.
• Compact BGA Package: 1152-ball FCBGA packaging offers a high-density footprint for space-constrained PCBs while maintaining surface-mount assembly.
• Low-Voltage Core: Core supply between 820 mV and 930 mV aligns with low-voltage power domains used in modern FPGA systems.

Why Choose 5SGSMD5H3F35M4?

The 5SGSMD5H3F35M4 positions itself as a high-capacity Stratix V GS FPGA optimized for applications that require a large programmable logic fabric, abundant embedded memory, and a high I/O count in a military-grade package. Its specifications make it suitable for complex embedded designs where environmental robustness and integration density are priorities.

Engineers and procurement teams looking for a scalable, documented FPGA solution will find this device appropriate for advanced communications, defense, and high-density logic implementations. Manufacturer datasheet resources provide the detailed electrical and switching characteristics needed to validate system-level integration.

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