5SGSMD5H3F35I4N

The 5SGSMD5H3F35I4N is an Intel Stratix V GS family FPGA supplied in a 1152-BBGA (FCBGA) surface-mount package. The device provides a high logic element count and substantial on-chip memory while supporting a large number of external I/Os, packaged and rated for industrial-temperature operation.

Key hardware attributes include 457,000 logic elements, approximately 39.9 Mbits of embedded memory, 552 user I/Os, a core supply range of 820 mV to 880 mV, and an operating temperature range of –40 °C to 100 °C.

Key Features

• Core Density  457,000 logic elements for large-scale programmable logic integration and complex logic implementation.
• Embedded Memory  Approximately 39.9 Mbits of on-chip RAM to support large buffering, state storage, and embedded data structures.
• I/O Capacity  552 user I/Os to accommodate wide parallel interfaces, numerous peripherals, and high pin-count system designs.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV for the device core domain.
• Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for board-level integration.
• Industrial Temperature Rating  Rated for operation from –40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS-compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density logic and control systems  Use the large logic element count and embedded RAM to implement complex custom logic, state machines, and control architectures.
• High I/O interface platforms  552 I/Os enable extensive peripheral connectivity and multi-channel interfacing for systems requiring broad external device support.
• Industrial equipment  Industrial temperature rating supports deployment in factory automation, instrumentation, and other industrial environments.

Unique Advantages

• High integration density: 457,000 logic elements and ~39.9 Mbits of embedded memory reduce the need for external logic and memory components.
• Large I/O resource: 552 user I/Os simplify board-level routing of multiple interfaces and sensors without multiple bridge devices.
• Industrial-ready thermal range: Specified operation from –40 °C to 100 °C enables reliable use in temperature-variable installations.
• Compact surface-mount package: 1152-BBGA (35×35) FCBGA package supports high-density PCB designs while maintaining robust soldered connections.
• Regulatory compliance: RoHS-compliant construction supports environmentally conscious product designs and market requirements.

Why Choose 5SGSMD5H3F35I4N?

The 5SGSMD5H3F35I4N combines substantial programmable logic capacity with ample embedded memory and high I/O density in a compact FCBGA package, making it suitable for designs that require integrated, high-capacity FPGA resources and broad external connectivity. Its industrial temperature rating and RoHS compliance contribute to long-term reliability and regulatory alignment in demanding deployments.

This Stratix V GS device is positioned for engineers and system designers who need a high-density, industrial-grade FPGA platform with precise core-voltage requirements and a large number of I/Os to consolidate functions and streamline board-level integration.

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