5SGSMD5H3F35I3NYY

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 552 39936000 457000 1152-BBGA, FCBGA

Quantity 739 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5H3F35I3NYY – Stratix® V GS FPGA, Industrial Grade (1152-BBGA FCBGA)

The 5SGSMD5H3F35I3NYY is a Stratix® V GS field programmable gate array (FPGA) packaged in a 1152-BBGA FCBGA (1152-FBGA, 35×35) surface-mount package. It delivers very high logic density and on-chip memory capacity for demanding programmable-logic designs where scalability, integration, and industrial temperature operation are required.

Documented in the Stratix V device datasheet, this industrial-grade device is specified for operation from −40 °C to 100 °C and supports a low-voltage core supply, enabling designs that balance performance and power envelope requirements.

Key Features

  • High logic density — 457,000 logic elements (LEs) to implement complex, large-scale digital designs.
  • Embedded memory — approximately 39.9 Mbits of on-chip RAM for wide buffering, lookup tables, and state storage.
  • Extensive I/O — 552 user I/O pins to accommodate high-pin-count interfaces and multi-channel connectivity.
  • Package and mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact system integration.
  • Industrial temperature rating — qualified for operation from −40 °C to 100 °C to meet elevated environmental requirements.
  • Core voltage — low-voltage core supply range from 820 mV to 880 mV to align with modern power-optimized system designs.
  • Regulatory compliance — RoHS compliant.

Unique Advantages

  • Very large programmable fabric: 457,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level complexity.
  • Substantial on-chip memory: approximately 39.9 Mbits of RAM enable local data storage and high-throughput buffering without external memory dependence.
  • High I/O count: 552 I/O pins allow for dense peripheral connectivity and multiple parallel interfaces directly from the device.
  • Industrial robustness: Specified for −40 °C to 100 °C operation for deployment in thermally challenging environments.
  • Compact, high-pin-count package: 1152-BBGA FCBGA (35×35) offers a space-efficient footprint while preserving high interconnect density.
  • Low-voltage core operation: 0.82–0.88 V supply supports power-managed designs and modern power-architecture integration.

Why Choose 5SGSMD5H3F35I3NYY?

This Stratix V GS device combines large-scale programmable logic, significant embedded memory, and a high I/O count in a compact, industrial-rated FCBGA package. It is suited to design teams that need to integrate complex digital functions while meeting thermal and power constraints.

Backed by the Stratix V device documentation, the 5SGSMD5H3F35I3NYY provides a documented platform for engineers seeking a high-density, industrial-grade FPGA solution with clear electrical and package specifications.

Request a quote or submit an inquiry today to obtain pricing, availability, and lead-time information for the 5SGSMD5H3F35I3NYY.

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