5SGSMD5H3F35I4

The 5SGSMD5H3F35I4 is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable logic fabric with a large on-chip memory footprint and an extensive I/O count in a 1152-ball BGA FCBGA package.

This device is targeted at designs that require substantial logic capacity, significant embedded memory, and high I/O connectivity, with industrial-grade operating range and surface-mount package options for compact, high-pin-count implementations.

Key Features

• High-density logic  Approximately 457,000 logic elements (logic cells) to implement complex digital functions and large-scale parallel architectures.
• Substantial embedded memory  Approximately 39.9 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• Extensive I/O  Up to 552 user I/O pins for wide bus interfaces, multi-channel connectivity, and high-pin-count system integration.
• Industrial operating range  Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-extreme environments.
• Low-voltage core operation  Core supply range of 820 mV to 880 mV for compatibility with low-voltage power domains.
• Package and mounting  1152-ball BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount PCB assembly.

Typical Applications

• High-density logic implementations  Deploy the device where large-scale programmable logic capacity is required to map complex algorithms or custom datapaths.
• I/O‑intensive systems  Use the 552 I/Os for designs that aggregate many parallel interfaces, bridge multiple buses, or implement multi‑lane front-ends.
• Memory-centric designs  Embedded memory approaching 40 Mbits supports buffering, packet processing, and large lookup-table requirements without external RAM.
• Industrial-grade solutions  The −40 °C to 100 °C operating window suits deployed systems that must tolerate extended temperature ranges.

Unique Advantages

• Large programmable fabric: 457,000 logic elements enable implementation of complex, high-parallelism designs without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 39.9 Mbits of embedded memory reduces dependency on external memory for many buffering and processing tasks.
• High I/O density: 552 I/Os simplify board-level routing for multi‑interface and multi‑channel systems, reducing the need for external multiplexing.
• Industrial temperature rating: Operational range from −40 °C to 100 °C supports robust field deployments.
• Compact, high-pin-count package: 1152-ball FCBGA (35×35) provides a dense footprint for maximum connectivity in space-constrained designs.
• Low-voltage core: 820–880 mV core supply aligns with modern low-voltage power architectures for efficient power management.

Why Choose 5SGSMD5H3F35I4?

The 5SGSMD5H3F35I4 combines a high number of logic elements, substantial embedded RAM, and a large I/O complement in a rugged industrial temperature profile and a compact FCBGA package. This combination makes it suitable for engineers building high-density, I/O-rich systems that need significant on-chip resources while maintaining a compact PCB footprint.

As a member of the Stratix V GS family from Intel, the device provides a verified platform for designs that demand scalability and integration of large digital functions, embedded memory, and extensive connectivity.

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