5SGSMD5H3F35I4G

The 5SGSMD5H3F35I4G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade and a 1152‑ball BGA (FCBGA) package. It delivers large on‑chip logic and memory resources with high I/O density for complex, high‑integration digital designs.

Designed for applications that require substantial programmable logic capacity, abundant embedded memory and extensive I/O, this device supports deployment across industrial environments thanks to its −40 °C to 100 °C operating range and surface‑mount package format.

Key Features

• Core Logic — 457,000 logic elements to implement high‑density combinational and sequential logic.
• Embedded Memory — Approximately 39.9 Mbits of on‑chip RAM for buffering, FIFOs and local data storage.
• I/O Density — 552 I/O pins to support wide parallel interfaces and multiple high‑pin‑count peripherals.
• Package and Mounting — 1152‑BBGA (supplier package listed as 1152‑FBGA, 35×35) in a surface‑mount FCBGA form factor for board‑level integration.
• Industrial Grade Operation — Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Core Voltage — Operates with a core supply in the 820 mV to 880 mV range.

Typical Applications

• Networking and Communications — High I/O count and Stratix V GS family transceiver capability make this device suitable for protocol bridging, switching logic and interface aggregation.
• High‑Density Digital Processing — Large logic element count and substantial embedded RAM enable complex DSP pipelines, custom accelerators and wide datapath implementations.
• Industrial Control and Automation — Industrial temperature rating and robust package options support control systems, motor drives and factory automation platforms.

Unique Advantages

• High logic capacity: 457,000 logic elements reduce the need for multi‑FPGA partitioning in large designs.
• Significant on‑chip memory: Approximately 39.9 Mbits of embedded RAM supports deep buffering and local data storage, improving throughput.
• Extensive I/O: 552 I/Os enable broad peripheral connectivity and wide parallel interfaces without external expander logic.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact FCBGA packaging: 1152‑ball BGA (35×35) balances high pin count with a board‑level footprint suitable for dense PCBs.
• Low‑voltage core: 820–880 mV supply range supports power budgeting and thermal planning for system designers.

Why Choose 5SGSMD5H3F35I4G?

The 5SGSMD5H3F35I4G combines large programmable logic, substantial embedded memory and high I/O density in an industrial‑rated Stratix V GS device. It is well suited for engineering teams building complex digital systems that require on‑chip resources and reliability across a wide temperature range.

Backed by Intel’s Stratix V documentation and electrical characterization, this FPGA offers a clear specification set for system architects and procurement teams focused on scalability, integration and predictable operating margins.

Request a quote or submit an inquiry to learn more about availability, lead times and volume pricing for the 5SGSMD5H3F35I4G.