5SGXEA7K2F35C2N

The 5SGXEA7K2F35C2N is a Stratix® V GX family Field Programmable Gate Array (FPGA) from Intel. This commercial-grade FPGA combines high logic density, abundant embedded memory, and a large I/O count in a 1152-FBGA (35×35) surface-mount package.

Designed for high-density, board-level digital designs, the device provides a comprehensive resource set — including approximately 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM — for applications that require substantial programmable logic and memory capacity while operating within a commercial temperature range.

Key Features

• High Logic Capacity  Approximately 622,000 logic elements to implement complex digital functions and large-scale RTL designs.
• Embedded Memory  Approximately 51.2 Mbits of total RAM bits for data buffering, FIFOs, and on-chip storage.
• Large I/O Count  432 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting  1152-FBGA (35×35) package in an FCBGA format; surface-mount for standard PCB assembly flows.
• Power and Supply  Core voltage supply range of 870 mV to 930 mV to match system power rails and core requirements.
• Commercial Temperature Grade  Rated for operation from 0°C to 85°C for commercial-environment applications.
• Standards and Compliance  RoHS compliant to meet common environmental and regulatory requirements.
• Stratix V GX Family  Part of the Stratix V GX device family; documentation for the family details electrical and switching characteristics, operating conditions, and transceiver speed grade options.

Typical Applications

• High-density FPGA designs  Use the device when large amounts of programmable logic (≈622k logic elements) and embedded memory (≈51.2 Mbits) are required for complex processing and control functions.
• Multi-interface systems  The 432 I/O pins support designs that need extensive parallel or mixed I/O connectivity for peripherals, sensors, or external memory interfaces.
• Board-level integration  The 1152-FBGA (35×35) surface-mount package enables compact PCB implementations where high logic and I/O density are priorities.

Unique Advantages

• Substantial on-chip resources: The combination of ≈622,000 logic elements and ≈51.2 Mbits of RAM reduces reliance on external logic and memory, simplifying system BOM.
• High I/O count: 432 I/Os permit broad connectivity without additional I/O expanders, enabling cleaner board layouts and fewer components.
• Commercial-grade operating range: Specified 0°C to 85°C operation aligns with standard commercial deployments and product environments.
• Compact BGA packaging: The 1152-FBGA (35×35) package delivers a high-density pinout in a space-efficient footprint for board-level deployments.
• Documented device family: Stratix V GX family documentation provides electrical and switching characteristics to support integration and system-level planning.
• RoHS compliant: Supports regulatory and environmental compliance requirements common to modern electronics manufacturing.

Why Choose 5SGXEA7K2F35C2N?

The 5SGXEA7K2F35C2N delivers a blend of high logic capacity, sizable embedded memory, and extensive I/O in a commercial-grade Stratix V GX FPGA package. It is suited for designs that demand substantial on-chip resources and flexible interfacing while maintaining a compact board footprint.

Engineers specifying this device benefit from clear device-level documentation for the Stratix V family and a device package and thermal envelope aligned with standard surface-mount assembly practices, making it a practical choice for scalable digital designs and complex system integration.

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