5SGXEA7K2F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 979 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K2F35I2G – Stratix V GX FPGA, 1152-BBGA
The 5SGXEA7K2F35I2G is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package. It delivers high-density programmable logic, a large embedded memory resource, and a substantial I/O count for complex digital designs.
Designed for industrial temperature operation, this device targets applications that require extensive logic capacity, on-chip memory and flexible I/O brought together in a surface-mount BGA package.
Key Features
- Logic Capacity 622,000 logic elements to support large, high-density designs and complex logic integration.
- Embedded Memory Approximately 51.2 Mbits of embedded memory for on-chip buffering, data storage, and state machines.
- I/O Resources 432 user I/O pins to enable broad connectivity for parallel interfaces, external memories, and board-level signaling.
- Power and Voltage Core voltage supply range specified at 870 mV to 930 mV for the device core operating conditions.
- Package & Mounting 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35x35). Surface-mount mounting type for modern PCB assembly.
- Temperature Grade Industrial grade operation from -40°C to 100°C to meet elevated ambient and industrial environment requirements.
- Standards & Documentation RoHS compliant; detailed electrical and switching characteristics are documented in the Stratix V device datasheet.
Unique Advantages
- High-density programmable logic: 622,000 logic elements enable consolidation of complex subsystems into a single device.
- Significant on-chip memory: Approximately 51.2 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage needs.
- Large I/O complement: 432 I/O pins provide flexibility for wide parallel interfaces and multi-channel board designs.
- Industrial temperature capability: Rated from -40°C to 100°C for reliable operation in industrial environments.
- Compact BGA package: 1152-ball BGA FCBGA package provides high pin density in a surface-mount form factor suitable for compact PCBs.
- Regulatory and design confidence: RoHS compliance and full datasheet coverage for electrical/switching characteristics support design validation and compliance efforts.
Why Choose 5SGXEA7K2F35I2G?
The 5SGXEA7K2F35I2G brings together a very large logic fabric, substantial embedded memory, and a high I/O count in a surface-mount 1152-BBGA package rated for industrial temperature use. These characteristics make it well suited for designs that demand dense logic integration and on-chip memory while maintaining flexible board-level connectivity.
With documented operating conditions and electrical characteristics in the Stratix V device datasheet and RoHS compliance, this device supports engineers and procurement teams seeking a high-capacity FPGA solution for long-term, industrial deployments.
Request a quote or submit an inquiry to initiate pricing and availability for 5SGXEA7K2F35I2G and to discuss lead times and ordering details.

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