5SGXEA7K2F35I2G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 979 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F35I2G – Stratix V GX FPGA, 1152-BBGA

The 5SGXEA7K2F35I2G is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package. It delivers high-density programmable logic, a large embedded memory resource, and a substantial I/O count for complex digital designs.

Designed for industrial temperature operation, this device targets applications that require extensive logic capacity, on-chip memory and flexible I/O brought together in a surface-mount BGA package.

Key Features

  • Logic Capacity 622,000 logic elements to support large, high-density designs and complex logic integration.
  • Embedded Memory Approximately 51.2 Mbits of embedded memory for on-chip buffering, data storage, and state machines.
  • I/O Resources 432 user I/O pins to enable broad connectivity for parallel interfaces, external memories, and board-level signaling.
  • Power and Voltage Core voltage supply range specified at 870 mV to 930 mV for the device core operating conditions.
  • Package & Mounting 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35x35). Surface-mount mounting type for modern PCB assembly.
  • Temperature Grade Industrial grade operation from -40°C to 100°C to meet elevated ambient and industrial environment requirements.
  • Standards & Documentation RoHS compliant; detailed electrical and switching characteristics are documented in the Stratix V device datasheet.

Unique Advantages

  • High-density programmable logic: 622,000 logic elements enable consolidation of complex subsystems into a single device.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage needs.
  • Large I/O complement: 432 I/O pins provide flexibility for wide parallel interfaces and multi-channel board designs.
  • Industrial temperature capability: Rated from -40°C to 100°C for reliable operation in industrial environments.
  • Compact BGA package: 1152-ball BGA FCBGA package provides high pin density in a surface-mount form factor suitable for compact PCBs.
  • Regulatory and design confidence: RoHS compliance and full datasheet coverage for electrical/switching characteristics support design validation and compliance efforts.

Why Choose 5SGXEA7K2F35I2G?

The 5SGXEA7K2F35I2G brings together a very large logic fabric, substantial embedded memory, and a high I/O count in a surface-mount 1152-BBGA package rated for industrial temperature use. These characteristics make it well suited for designs that demand dense logic integration and on-chip memory while maintaining flexible board-level connectivity.

With documented operating conditions and electrical characteristics in the Stratix V device datasheet and RoHS compliance, this device supports engineers and procurement teams seeking a high-capacity FPGA solution for long-term, industrial deployments.

Request a quote or submit an inquiry to initiate pricing and availability for 5SGXEA7K2F35I2G and to discuss lead times and ordering details.

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