5SGXEA7K2F35I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,985 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEA7K2F35I2N is a Stratix V GX family FPGA from Intel, offered in an industrial temperature grade and supplied in a 1152-BBGA FCBGA package. This high-density programmable device combines large logic capacity, extensive I/O, and substantial on-chip RAM to address complex digital designs that require programmable routing, high I/O counts, and precise power operating windows.
Designed for applications that demand robust, scalable programmable logic, the device’s characteristics—including 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 user I/Os—support implementation of large custom accelerators, high-channel-count interfaces, and compute-intensive datapaths.
Key Features
- Logic Capacity — 622,000 logic elements and 234,720 logic blocks provide significant combinational and sequential resources for complex designs.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for FIFOs, buffers, and scratchpad storage to support data-intensive logic.
- I/O Resources — 432 user I/Os suitable for high pin-count interfaces and multi-channel connectivity.
- Power and Core Voltage — Core supply range specified at 870 mV to 930 mV for defined operating margins and power planning.
- Package and Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for PCB integration.
- Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsher environments.
- Standards and Compliance — RoHS compliant, aligning with lead-free assembly and environmental requirements.
- Series Documentation — Part of the Stratix V device family with published electrical and switching characteristics covering operating conditions and transceiver/core performance.
Typical Applications
- Industrial Control and Automation — Implement complex control logic, deterministic I/O interfacing, and custom protocol handling using the device’s high logic capacity and industrial temperature rating.
- High‑Performance Signal Processing — Build DSP pipelines, packet processors, and custom arithmetic datapaths leveraging large embedded RAM and abundant logic elements.
- Communications and Networking — Support multi‑lane interfaces and high I/O connectivity for PHY bridging, aggregator functions, and programmable packet handling.
- Test & Measurement and Instrumentation — Deploy in equipment requiring precise timing, high channel counts, and resilient operation across −40 °C to 100 °C.
Unique Advantages
- High Logic Density: 622,000 logic elements enable implementation of large, consolidated designs that reduce the need for multiple devices.
- Substantial On‑Chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence for buffers and local data storage.
- Large I/O Count: 432 user I/Os permit extensive peripheral integration and multi-channel interfacing without extensive level-shifting circuitry.
- Industrial‑Grade Reliability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements in industrial deployments.
- Compact, Surface‑Mount Package: 1152‑BBGA FCBGA (35×35) offers a high‑pin‑count solution in a compact footprint for dense PCB layouts.
- Defined Power Envelope: Core voltage range of 870 mV–930 mV allows precise power-supply design for predictable device behavior.
Why Choose 5SGXEA7K2F35I2N?
The 5SGXEA7K2F35I2N positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances large programmable logic resources, extensive on-chip memory, and a high I/O count within a 1152‑BBGA package. Its documented operating conditions and family-level electrical characteristics make it suitable for design teams consolidating complex functions into a single device for industrial and communications-focused systems.
Choose this device when your design requires significant logic and memory resources, robust I/O capability, and operation across wide ambient temperatures—backed by the Stratix V family documentation and Intel’s device support materials.
Request a quote or submit a pricing and availability inquiry to begin integrating the 5SGXEA7K2F35I2N into your next design.

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