5SGXEA7K2F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 1,985 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA7K2F35I2N is a Stratix V GX family FPGA from Intel, offered in an industrial temperature grade and supplied in a 1152-BBGA FCBGA package. This high-density programmable device combines large logic capacity, extensive I/O, and substantial on-chip RAM to address complex digital designs that require programmable routing, high I/O counts, and precise power operating windows.

Designed for applications that demand robust, scalable programmable logic, the device’s characteristics—including 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 432 user I/Os—support implementation of large custom accelerators, high-channel-count interfaces, and compute-intensive datapaths.

Key Features

  • Logic Capacity — 622,000 logic elements and 234,720 logic blocks provide significant combinational and sequential resources for complex designs.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for FIFOs, buffers, and scratchpad storage to support data-intensive logic.
  • I/O Resources — 432 user I/Os suitable for high pin-count interfaces and multi-channel connectivity.
  • Power and Core Voltage — Core supply range specified at 870 mV to 930 mV for defined operating margins and power planning.
  • Package and Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for PCB integration.
  • Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsher environments.
  • Standards and Compliance — RoHS compliant, aligning with lead-free assembly and environmental requirements.
  • Series Documentation — Part of the Stratix V device family with published electrical and switching characteristics covering operating conditions and transceiver/core performance.

Typical Applications

  • Industrial Control and Automation — Implement complex control logic, deterministic I/O interfacing, and custom protocol handling using the device’s high logic capacity and industrial temperature rating.
  • High‑Performance Signal Processing — Build DSP pipelines, packet processors, and custom arithmetic datapaths leveraging large embedded RAM and abundant logic elements.
  • Communications and Networking — Support multi‑lane interfaces and high I/O connectivity for PHY bridging, aggregator functions, and programmable packet handling.
  • Test & Measurement and Instrumentation — Deploy in equipment requiring precise timing, high channel counts, and resilient operation across −40 °C to 100 °C.

Unique Advantages

  • High Logic Density: 622,000 logic elements enable implementation of large, consolidated designs that reduce the need for multiple devices.
  • Substantial On‑Chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence for buffers and local data storage.
  • Large I/O Count: 432 user I/Os permit extensive peripheral integration and multi-channel interfacing without extensive level-shifting circuitry.
  • Industrial‑Grade Reliability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements in industrial deployments.
  • Compact, Surface‑Mount Package: 1152‑BBGA FCBGA (35×35) offers a high‑pin‑count solution in a compact footprint for dense PCB layouts.
  • Defined Power Envelope: Core voltage range of 870 mV–930 mV allows precise power-supply design for predictable device behavior.

Why Choose 5SGXEA7K2F35I2N?

The 5SGXEA7K2F35I2N positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances large programmable logic resources, extensive on-chip memory, and a high I/O count within a 1152‑BBGA package. Its documented operating conditions and family-level electrical characteristics make it suitable for design teams consolidating complex functions into a single device for industrial and communications-focused systems.

Choose this device when your design requires significant logic and memory resources, robust I/O capability, and operation across wide ambient temperatures—backed by the Stratix V family documentation and Intel’s device support materials.

Request a quote or submit a pricing and availability inquiry to begin integrating the 5SGXEA7K2F35I2N into your next design.

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