5SGXEA7K2F35I2LG

The 5SGXEA7K2F35I2LG is an industrial‑grade Stratix® V GX field programmable gate array (FPGA) from Intel. It offers a high logic density architecture with extensive I/O and large on‑chip memory, packaged in a high‑pin‑count 1152‑BBGA (FCBGA) footprint suitable for space‑constrained, high‑performance designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, this device targets applications that require dense programmable logic, wide I/O count (432 pins), and operation across an extended temperature range.

Key Features

• Core Logic  Provides 622,000 logic elements to implement large, complex logic and custom hardware functions.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and data storage directly in the FPGA fabric.
• I/O Capacity  432 user I/O pins support extensive interfacing and board-level connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) / supplier package 1152‑FBGA (35×35) in a surface‑mount form factor for compact, high‑pin‑count designs.
• Voltage Supply  Core voltage range specified at 820 mV to 880 mV, enabling targeted power delivery designs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended‑temperature environments.
• Standards & Compliance  RoHS‑compliant manufacturing status.
• Stratix V GX Family  Part of the Stratix V GX family of devices; series documentation details available device speed‑grade and transceiver options for designs that require transceiver capabilities and graded performance.

Typical Applications

• Industrial Control & Automation  Industrial grade temperature range and high logic density make this device suitable for complex control algorithms and real‑time processing in automation systems.
• Communications & Networking  High I/O count and family transceiver support (Stratix V GX family) accommodate dense protocol interfacing and data‑plane processing in network equipment.
• High‑Density Custom Compute  Large logic and embedded memory resources enable custom accelerators, signal processing pipelines, and system‑level integration in compute‑intensive designs.

Unique Advantages

• High Logic Capacity: 622,000 logic elements provide headroom for complex designs and multi‑function integration.
• Significant Embedded RAM: Approximately 51.2 Mbits of on‑chip memory reduces external memory dependency and improves data locality.
• Large I/O Surface: 432 I/O pins simplify board interfacing and enable broad connectivity to peripherals, sensors, and transceivers.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet extended environmental requirements common in industrial deployments.
• Compact, High‑Pin Package: 1152‑BBGA (35×35) FCBGA package delivers high pin count in a compact surface‑mount form factor for dense system boards.
• Regulatory Compliance: RoHS‑compliant manufacturing supports modern environmental and materials requirements.

Why Choose 5SGXEA7K2F35I2LG?

The 5SGXEA7K2F35I2LG combines high logic density, abundant embedded memory, and a large I/O complement in an industrial‑grade Stratix V GX FPGA package. It is positioned for engineers designing systems that demand programmable, high‑performance logic and broad interfacing while operating across extended temperature ranges.

This device is well suited for teams building scalable, robust hardware where integration density, on‑chip memory capacity, and industrial environmental tolerance are priorities. Support and documentation for the Stratix V family are available to guide speed‑grade and transceiver selections for system‑level requirements.

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