5SGXEA7K2F35I2LN

The 5SGXEA7K2F35I2LN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It delivers very high logic density and on‑chip memory with a large I/O count and industrial temperature capability, making it suitable for complex, I/O‑intensive embedded and industrial systems.

As a member of the Stratix V family, this device aligns with the series’ documented industrial and commercial speed‑grade offerings and GX transceiver options described in the Stratix V device documentation.

Key Features

• High Logic Density — 622,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to support buffering, packet processing, and data‑intensive functions.
• Extensive I/O — 432 user I/O pins to support broad peripheral and high‑pin‑count interface integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable deployment in industrial environments.
• Power Core Supply — Core voltage supply range 820 mV to 880 mV for defined power budgeting and system power-rail design.
• Package & Mounting — 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35 × 35) in a surface‑mount form factor for high‑density board designs.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control: High logic density and industrial temperature rating enable complex motor control, PLC augmentation, and factory automation functions.
• Communications Infrastructure: Large on‑chip RAM and abundant I/O make the device suitable for switching, routing, and protocol processing in networking equipment.
• High‑Performance Embedded Systems: Use as the programmable logic backbone for compute‑intensive embedded applications that require large logic and memory resources.
• FPGA‑Based Acceleration & Prototyping: Capacity and I/O resources support hardware acceleration tasks and rapid prototyping of large digital designs.

Unique Advantages

• Scale to Complex Designs: 622,000 logic elements provide the capacity to implement large and multi‑functional FPGA designs without external logic.
• Large On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external buffering and simplifies memory architecture.
• High I/O Count: 432 I/Os allow direct interfacing to many peripherals and high‑density connectors, minimizing external bridging components.
• Industrial Reliability: −40 °C to 100 °C operating range supports deployment in harsh and temperature‑varying industrial environments.
• Compact, Surface‑Mount Package: 1152‑BBGA (35 × 35) FCBGA package enables high‑density PCB layouts while keeping a standardized BGA form factor.
• Standards‑aligned Supply: Defined core voltage range (820–880 mV) facilitates predictable power‑rail planning and system integration.

Why Choose 5SGXEA7K2F35I2LN?

The 5SGXEA7K2F35I2LN combines substantial logic capacity, significant embedded memory, and a high I/O count in a compact surface‑mount FCBGA package, positioning it for demanding industrial and high‑performance embedded designs. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle deployments where environmental robustness and regulatory alignment are required.

This Stratix V GX device is appropriate for engineering teams designing complex digital systems that require integrated memory, abundant I/O, and scalable logic resources, while leveraging the broader Stratix V documentation and ecosystem for system‑level integration.

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