5SGXEA7K2F35C3N

The 5SGXEA7K2F35C3N is a Stratix V GX family FPGA in a 1152-BBGA (35×35) FCBGA package, offering a large programmable fabric and abundant I/O for complex digital designs. With 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, this commercial-grade device targets systems that require substantial on-chip logic capacity and memory integration.

Stratix V GX devices are available in multiple commercial and industrial speed grades and include transceiver options within the family; this part provides a high-density fabric and extensive I/O for applications that demand dense logic, memory, and connectivity in a surface-mount BGA package.

Key Features

• Logic Capacity 622,000 logic elements suitable for large-scale digital designs and complex FPGA implementations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and data-intensive processing.
• I/O Resources 432 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35); surface-mount for standard PCB assembly flows.
• Power Supply Range Core voltage supply specified from 820 mV to 880 mV for system power planning.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C.
• Compliance RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• High-speed communications Leverage the Stratix V GX family transceiver offerings and the device's large I/O count to implement multi-channel serial links and protocol bridging.
• Signal processing and compute acceleration 622,000 logic elements and ~51.2 Mbits of embedded RAM provide on-chip resources for parallel processing, custom datapaths, and buffering.
• Complex system integration High I/O density and a compact 1152-BBGA package enable integration of multiple interfaces and peripherals in a single FPGA for space-constrained designs.

Unique Advantages

• Large programmable fabric: 622,000 logic elements allow implementation of sizable custom logic blocks and state machines without external logic.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffer and cache requirements.
• Extensive I/O count: 432 I/Os support broad interfacing capability—useful for parallel buses, multiple peripherals, and mixed-signal front ends.
• Compact, industry-standard packaging: 1152-BBGA (35×35) enables high-density PCB layouts while supporting surface-mount assembly processes.
• Commercial temperature rating: Rated for 0 °C to 85 °C for designs targeting commercial operating environments.
• Regulatory readiness: RoHS compliance aligns with modern manufacturing and environmental requirements.

Why Choose 5SGXEA7K2F35C3N?

The 5SGXEA7K2F35C3N combines a high-density Stratix V GX FPGA fabric with substantial embedded memory and a large I/O set in a compact BGA package, making it well suited for designs that require on-chip capacity for logic, buffering, and multi-interface connectivity. Its commercial temperature rating and defined core voltage range support predictable integration into production systems.

This part is appropriate for engineering teams building communication interfaces, data-path accelerators, and dense system integrations that need a single FPGA solution to consolidate functionality and reduce external components. Choosing this device provides a path to scale within the Stratix V family for projects that may require different speed grades or transceiver capabilities.

If you would like pricing, availability, or to request a quote for 5SGXEA7K2F35C3N, please submit a parts inquiry or request a formal quote through your preferred procurement channel.