5SGXEA7K2F35C3

The 5SGXEA7K2F35C3 is a Stratix® V GX family field programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and substantial on-chip memory for complex digital designs.

Targeted at commercial temperature applications, this device combines a large I/O count and a tight core supply range for designs that require high integration, significant local memory, and extensive I/O connectivity.

Key Features

• Core Logic  622,000 logic elements (LEs) suitable for large, complex programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage.
• I/O Capacity  432 I/O pins for rich peripheral and board-level interfacing options.
• Power Supply  Core supply range of 820 mV to 880 mV to meet specified operating conditions.
• Package & Mounting  1152-FBGA (35×35) FCBGA package, surface-mount for compact, high-density board designs.
• Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS-compliant construction for regulatory environmental requirements.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM make this FPGA suitable for complex algorithm acceleration and signal processing tasks.
• I/O-intensive systems  With 432 I/O pins, use this device where extensive board-level interfacing or multiple peripheral connections are required.
• Prototype and system integration  The combination of high logic count and abundant embedded memory supports system prototyping and integration of multiple functions into a single device.

Unique Advantages

• High logic capacity: 622,000 logic elements enable implementation of large, multi-function designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependencies and speeds local data access.
• Extensive I/O: 432 dedicated I/O pins provide flexibility for diverse peripheral and board-level interfaces.
• Compact package footprint: 1152-ball FCBGA packaging offers high pin count in a compact 35×35 package for dense PCB layouts.
• Commercial temperature qualification: Rated for 0 °C to 85 °C to match a wide range of standard commercial electronic applications.
• Regulatory compliance: RoHS-compliant manufacturing supports environmental and supply-chain requirements.

Why Choose 5SGXEA7K2F35C3?

The 5SGXEA7K2F35C3 delivers a combination of large-scale programmable logic, significant embedded memory, and broad I/O capacity in a compact FCBGA package—making it well suited for demanding commercial designs that require integration of multiple digital functions. Its defined operating voltage window and commercial temperature rating provide clear electrical and thermal boundaries for system design.

As a member of the Stratix V GX family, the device aligns with a documented series-level platform and device datasheet information, supporting engineering evaluation and system-level planning for high-density FPGA implementations.

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