5SGXEA7K2F35I2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 772 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K2F35I2L – Stratix® V GX FPGA, 622,000 Logic Elements, ~51.2 Mbits RAM, 1152-BBGA
The 5SGXEA7K2F35I2L is a Stratix V GX field-programmable gate array (FPGA) from Intel designed for high‑density, high‑I/O applications. It combines large logic capacity, substantial embedded memory, and a high I/O count in a single surface-mount FCBGA package targeted at industrial-grade designs.
With family-level support for high-speed transceiver operation and an industrial operating temperature range, this device addresses applications that require significant on‑chip resources and robust environmental performance.
Key Features
- Logic Capacity 622,000 logic elements and 234,720 logic array blocks (LABs) provide extensive programmable fabric for complex logic and custom acceleration.
- Embedded Memory Approximately 51.2 Mbits of total on‑chip RAM to support large buffers, LUT-based engines, and state storage without external memory in many designs.
- I/O Resources 432 user I/O pins to interface with high-pin-count peripherals, multi-lane SERDES arrangements, and dense board-level connectivity.
- Power and Core Voltage Core supply range specified at 820 mV to 880 mV to meet the device’s defined operating conditions.
- Package and Mounting 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35 × 35). Surface-mount mounting type for standard PCB assembly.
- Temperature Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
- Compliance RoHS‑compliant for regulatory alignment in lead‑free assemblies.
- Stratix V GX Family Transceiver Support Stratix V GX family devices include transceiver speed grades; consult the Stratix V device datasheet for supported channel rates and speed‑grade options.
Typical Applications
- High‑performance data processing Large logic and memory resources enable compute‑intensive algorithms, packet processing, and custom accelerators implemented on‑chip.
- High‑density I/O systems The 432 I/O pins support multi‑channel interfaces, board‑level aggregation, and dense peripheral connectivity.
- Industrial and ruggedized equipment Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for controls, instrumentation, and other industrial deployments.
- High‑speed serial links (family support) As a Stratix V GX family device, it aligns with applications that require high‑speed transceivers; refer to the Stratix V datasheet for specific transceiver speed options.
Unique Advantages
- High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce dependence on external logic and memory, simplifying system design.
- Robust I/O capability: 432 I/Os allow extensive peripheral interfacing and support for multi‑lane I/O architectures without additional multiplexing hardware.
- Industrial temperature range: Rated for −40 °C to 100 °C operation, enabling reliable performance in challenging environmental conditions.
- Compact BGA footprint: 1152‑ball FCBGA package provides a high pin count in a compact footprint for space‑constrained PCBs.
- Standards‑aligned manufacturing: Surface-mount package and RoHS compliance streamline modern assembly and regulatory requirements.
- Family documentation and support: Backed by the Stratix V device datasheet and Intel’s device documentation for electrical, timing, and transceiver guidance.
Why Choose 5SGXEA7K2F35I2L?
The 5SGXEA7K2F35I2L delivers a combination of high logic and memory capacity, substantial I/O resources, and industrial temperature capability in a single Stratix V GX FPGA package. It is positioned for complex, resource‑intensive designs where on‑chip logic and memory density, combined with robust environmental performance, are primary requirements.
Designers targeting industrial systems, high‑density I/O applications, or projects that leverage the Stratix V family transceiver options will find this device well suited for scalable, long‑lifecycle deployments backed by Intel’s Stratix V documentation.
Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEA7K2F35I2L. Technical sales can provide lead times, volume pricing, and support materials to assist with evaluation and procurement.

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