5SGXEA7K2F35I3L

The 5SGXEA7K2F35I3L is an Intel Stratix V GX family FPGA in a high-density FCBGA package, designed for complex digital designs that require large logic capacity, substantial embedded memory, and extensive I/O. As a member of the Stratix V GX family, series-level documentation indicates availability of high-speed GX transceiver options.

This device targets applications that need a combination of logic density, on-chip memory, and robust industrial operating range, while offering a compact 1152-ball BGA package for system integration.

Key Features

• Logic Capacity  Approximately 622,000 logic elements (LEs) to implement large custom logic and data-path designs.
• Embedded Memory  Approximately 51.2 Mbits of embedded RAM for on-chip buffering, FIFOs, and large data-storage structures.
• I/O Density  432 user I/O pins to support wide parallel interfaces and multiple serial/parallel peripherals.
• Package  1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) for high pin-count routing in a compact footprint.
• Power Supply  Core supply window 820 mV to 880 mV, enabling defined voltage planning for core power domains.
• Industrial Temperature Range  Rated for operation from –40° C to 100° C, suitable for extended temperature deployments.
• Mounting and Compliance  Surface-mount device; RoHS compliant.
• Series-Level Transceiver Options  Stratix V GX family documentation lists GX transceiver channel options (series reference) across multiple speed grades.

Typical Applications

• High-speed serial communications  Utilize the Stratix V GX family transceiver options (series-level) for designs requiring high-bandwidth serial links.
• Compute and signal processing  High logic element count and large embedded memory enable implementation of complex DSP, packet-processing, and algorithm acceleration blocks on-chip.
• I/O-dense systems  Large number of user I/Os supports multiport interfaces, protocol bridging, and wide parallel data buses.
• Industrial and ruggedized equipment  Industrial temperature rating (–40° C to 100° C) fits applications that operate in extended-temperature environments.

Unique Advantages

• High logic and memory capacity: Large onboard resources reduce reliance on external logic and memory, simplifying system BOM and timing domains.
• Significant I/O availability: 432 I/Os enable complex interfacing and multi-protocol designs without extensive external multiplexing.
• Compact, high-pin-count package: 1152-ball FCBGA (35×35) balances pin density and board-space efficiency for compact system designs.
• Industrial temperature support: Rated for –40° C to 100° C to maintain operation across a wide range of environmental conditions.
• Defined core supply window: 820–880 mV core voltage specification supports precise power budgeting and regulator selection.
• Regulatory readiness: RoHS compliance supports inclusion in products targeting restricted-substance requirements.

Why Choose 5SGXEA7K2F35I3L?

This Stratix V GX device combines high logic density, substantial embedded memory, and a large I/O complement in a compact 1152-ball FCBGA package, making it well suited for demanding digital designs that require on-chip resources and robust thermal performance. The industrial temperature rating and defined core voltage range help simplify system-level qualification and power design.

Designers seeking a high-capacity, board-integrated FPGA for industrial and high-performance I/O applications will find the 5SGXEA7K2F35I3L appropriate for scalable, resource-intensive implementations while leveraging the Stratix V GX family’s documented transceiver options and device-level electrical characteristics.

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