5SGXEA7K2F35I3N

The 5SGXEA7K2F35I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-ball FCBGA package (35 × 35 mm). It delivers very large programmable logic capacity with 622,000 logic elements and approximately 51.2 Mbits of embedded memory, plus 432 device I/Os for high pin-count designs.

Designed for industrial temperature operation, this device targets applications that require dense on-chip logic and memory, broad I/O capability, and low-voltage core operation (820 mV to 880 mV). The part is RoHS-compliant and intended for surface-mount assembly in high-density systems.

Key Features

• Core & Logic  622,000 logic elements (cells) provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM to support large buffers, FIFOs, and data storage within the FPGA fabric.
• I/O & Packaging  432 I/O pins in a 1152-ball BGA (FCBGA / 1152-FBGA 35×35) package, enabling high pin-count board-level interfacing in a single device.
• Power  Core supply range: 820 mV to 880 mV, allowing designs to target the device’s specified core-voltage window.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Mounting & Compliance  Surface-mount BGA package is RoHS-compliant for regulatory and assembly requirements.
• Documentation  Supported by the Stratix V device datasheet and technical documentation for electrical and switching characteristics.

Typical Applications

• High-density FPGA systems  Use the large logic and memory resources to consolidate multiple functions into a single FPGA for space- and cost-efficient designs.
• Network and infrastructure hardware  High I/O count and dense on-chip RAM make the device suitable for packet buffering, protocol processing, and control-plane functions.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in factory automation and industrial monitoring equipment.
• Prototyping and complex SoC emulation  Ample logic elements and embedded memory provide a platform for hardware prototyping, IP integration, and system validation.

Unique Advantages

• Substantial logic capacity: 622,000 logic elements enable large-scale integration of custom logic, reducing the need for multiple devices.
• Large embedded memory: Approximately 51.2 Mbits of on-chip RAM supports data-intensive processing and reduces external memory dependence.
• High I/O density: 432 device I/Os in a 1152-ball FCBGA package provide flexibility for complex board interfaces and multi-channel systems.
• Industrial temperature support: Rated for −40 °C to 100 °C operation, allowing designs to meet wider environmental ranges.
• Low-voltage core operation: Core supply range of 820 mV–880 mV supports power-optimized system designs and controlled power budgeting.
• Standards-forward packaging: Surface-mount 1152-FBGA (35×35) package simplifies high-density PCB layout and assembly.

Why Choose 5SGXEA7K2F35I3N?

This Stratix V GX FPGA part number provides a high-capacity, industrial-grade programmable logic platform suited to designs that demand large on-chip logic and memory, substantial I/O, and a compact BGA footprint. Its specified core voltage range and temperature rating make it appropriate for systems where power and environmental robustness matter.

Engineers building complex communications, infrastructure, and industrial systems can leverage the device’s density and documentation to integrate multiple functions into a single FPGA, simplify board-level architecture, and scale designs with the Stratix V device documentation as a technical reference.

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