5SGXEA7K2F35I3LN

The 5SGXEA7K2F35I3LN is an Intel Stratix® V GX field‑programmable gate array (FPGA) supplied in a 1152‑BBGA (35 × 35 mm) FCBGA package. It delivers high logic density, a large embedded memory footprint, and extensive I/O capability for industrial‑grade designs.

This device is aimed at applications that require substantial on‑chip logic and memory resources while operating across a broad industrial temperature range. Key value propositions include high integration density, a wide operating temperature window, and low core voltage operation for optimized power domains.

Key Features

• Core Logic 622,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support large buffers, tables, and intermediate data storage.
• I/O Density 432 user I/O pins enable extensive external interfacing and high channel counts for system integration.
• Power Supply Core supply rated from 820 mV to 880 mV, suitable for low‑voltage FPGA core domains.
• Package & Mounting 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), designed for surface‑mount PCB assembly.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Environmental Compliance RoHS‑compliant construction for regulatory and assembly requirements.

Typical Applications

• High‑density digital processing — Builds complex logic and datapath implementations that benefit from 622,000 logic elements and abundant on‑chip RAM.
• High‑I/O systems — Integrates with multiple external peripherals and parallel interfaces using 432 dedicated I/O pins.
• Industrial embedded platforms — Supports designs that require industrial temperature operation (−40 °C to 100 °C) and RoHS compliance.

Unique Advantages

• Substantial logic capacity: 622,000 logic elements enable consolidation of complex functions into a single device, reducing board count and system complexity.
• Large embedded memory: Approximately 51.2 Mbits of on‑chip RAM supports large buffers and lookup tables without external memory.
• High I/O count: 432 I/Os allow flexible external connectivity and high channel parallelism for interface‑rich designs.
• Industrial temperature rating: −40 °C to 100 °C operation broadens deployment options for harsh or thermally variable environments.
• Compact BGA packaging: 1152‑BBGA (35×35 mm) package provides a balance of pin density and board‑level footprint for surface‑mount assembly.
• Low core voltage operation: 0.82 V–0.88 V supply range supports modern low‑voltage power domains.

Why Choose 5SGXEA7K2F35I3LN?

The 5SGXEA7K2F35I3LN positions itself as a high‑capacity Stratix V GX FPGA suitable for designs demanding large programmable logic and embedded memory alongside extensive I/O. Its industrial temperature rating and RoHS compliance make it appropriate for robust, long‑lifecycle embedded systems.

For engineering teams seeking a densely integrated FPGA solution with a compact BGA package and low core voltage operation, this device offers a combination of resources and environmental tolerance that supports scalable, high‑complexity designs.

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