5SGXEA7K2F35C2G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 640 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K2F35C2G – Stratix® V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 432 I/O

The 5SGXEA7K2F35C2G is a Stratix V GX field programmable gate array (FPGA) designed for commercial applications requiring large logic capacity, substantial on-chip memory, and broad I/O connectivity. Built on the Stratix V GX device family, this device addresses designs that need high integration of programmable logic, embedded RAM, and transceiver-capable architecture as described for the Stratix V series.

Key value for designers comes from a combination of high logic density, significant embedded memory, and a 1152-ball BGA package suitable for surface-mount assembly, enabling compact high-performance boards within the commercial temperature range.

Key Features

  • Core Logic Capacity  Provides 622,000 logic elements for complex digital designs and high-density implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data structures.
  • I/O Resources  432 device I/Os to support wide parallel interfaces, multi-channel connectivity, and extensive board-level interfacing.
  • Package  1152-ball BGA, FCBGA (supplier package: 1152-FBGA, 35 × 35 mm) optimized for surface-mount PCB assembly and high-density routing.
  • Power  Core supply range specified at 870 mV to 930 mV for the device core power rail.
  • Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Mounting  Surface-mount device suitable for modern PCB manufacturing processes.
  • Compliance  RoHS compliant.
  • Series Characteristics  Part of the Stratix V family with documented electrical and switching characteristics, including transceiver specifications and programmable I/O timing (see series datasheet for details).

Typical Applications

  • High-speed communications  Appropriate for designs that leverage the Stratix V GX series transceiver capabilities and rich I/O set to implement multi-channel communication interfaces and protocol engines.
  • Data processing and acceleration  Large logic capacity and abundant on-chip RAM enable hardware acceleration, packet processing, and custom data-path implementations.
  • Prototyping and complex system integration  High-density logic and memory resources support system prototyping where integration of multiple functions into a single FPGA reduces board-level complexity.

Unique Advantages

  • High logic density: 622,000 logic elements allow consolidation of complex functions and large finite-state machines into a single device, reducing BOM and interconnect complexity.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffering and local data storage, minimizing external memory needs.
  • Extensive I/O: 432 I/Os enable wide parallel interfaces, multiple peripheral connections, and flexible board partitioning.
  • Compact BGA package: 1152-ball FCBGA (35 × 35 mm) offers a compact form factor for high-density PCB designs while supporting surface-mount assembly processes.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial production requirements.
  • Defined core power range: Core voltage specified between 870 mV and 930 mV to guide power-supply design and ensure predictable power characteristics.

Why Choose 5SGXEA7K2F35C2G?

The 5SGXEA7K2F35C2G combines high logic capacity, significant embedded RAM, and extensive I/O in a compact 1152-ball BGA package, positioning it for commercial designs that demand integrated programmable logic and memory resources. It is suitable for teams implementing complex data-paths, communication interfaces, and system-level functions where board-level consolidation and predictable electrical characteristics are important.

As a member of the Stratix V GX family, this device benefits from the series’ documented electrical and switching characteristics, enabling designers to align device selection with system performance targets while leveraging established device documentation for implementation details.

Request a quote or submit a pricing inquiry to evaluate 5SGXEA7K2F35C2G for your next high-density FPGA design.

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