5SGXEA7K2F35C2

The 5SGXEA7K2F35C2 is a Stratix V GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-ball FCBGA package. It provides a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory to support complex digital designs in commercial applications.

With 432 user I/O, RoHS compliance, and a commercial operating temperature range, this device is suited for systems requiring high logic capacity, substantial on-chip RAM, and a compact surface-mount FCBGA package.

Key Features

• Logic Capacity 622,000 logic elements for large-scale digital integration and complex RTL implementations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O 432 user I/O pins to interface with peripherals, high-speed links, and board-level signals.
• Package and Mounting 1152-BBGA (FCBGA) supplier package — 1152-FBGA (35×35) — designed for surface-mount PCB assembly.
• Power Core voltage supply range of 870 mV to 930 mV to match platform power-rail specifications.
• Temperature Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High-performance digital processing Use the dense logic fabric and substantial on-chip RAM for custom datapaths, packet processing, and real-time data manipulation.
• Prototyping and system validation Leverage the large logic count and plentiful I/O to validate complex system architectures before ASIC implementation.
• Network and communications equipment Deploy the device where high logic density and many I/Os are required for protocol handling and interface aggregation.
• Industrial control and instrumentation (commercial-grade) Implement control logic, signal conditioning, and data acquisition in commercial-temperature environments.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple devices and simplify board-level design.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes dependence on external memory for many workloads.
• Generous I/O count: 432 I/O provide flexibility for multi-channel interfaces and mixed-signal front-ends.
• Compact, production-ready package: 1152-ball FCBGA (35×35) supports high-pin-count designs in a compact footprint suited for surface-mount assembly.
• Commercial temperature rating: Rated 0 °C to 85 °C for applications targeting commercial environments.
• Regulatory compliance: RoHS-compliant for use in lead-free manufacturing processes.

Why Choose 5SGXEA7K2F35C2?

The 5SGXEA7K2F35C2 delivers a balance of high logic density, significant embedded memory, and extensive I/O in a surface-mount FCBGA package, positioning it for commercial designs that demand substantial programmable capacity without external memory dependency. Its specified core voltage range and commercial temperature rating make it suitable for production systems targeted at mainstream markets.

Engineers and system architects can use this device to consolidate functions, reduce board-level component count, and accelerate development cycles for complex digital and communication-oriented designs while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to purchase the 5SGXEA7K2F35C2 and discuss availability and lead times for your project requirements.